The multidimensional integrated intelligent imaging project (MI-3)
- Allinson, Nigel
- Anaxagoras, Thalis
- Aveyard, J.
- Arvanitis, C.
- Bates, R.
- Blue, A.
- Bohndiek, S.
- Cabello, J.
- Chen, L.
- Clark, A.
- Clayton, C.
- Cook, E.
- Cossins, A.
- Crooks, J.
- El-Gomati, M.
- Evans, G. M.
- Faruqi, W.
- French, M.
- Gow, J.
- Greenshaw, T.
- Greig, T.
- Guerrini, N.
- Harris, E.J.
- Henderson, R.
- Holland, A.
- Jeyasundra, G.
- Karadaglic, D.
- Konstantinidis, A.
- Liang, H. X.
- Maini, K. M. S.
- McMullen, G.
- Olivo, A.
- O'Shea, V.
- Osmond, J.
- Ott, R. J.
- Prydderch, M.
- Qiang, L.
- Riley, G.
- Royle, G.
- Segneri, G.
- Speller, R.
- Symonds-Tayler, J. R. N.
- Triger, S.
- Turchetta, R.
- Venanzi, C.
- Wells, K.
- Zha, X.
- Zin, H.
DOIAbstract
MI-3 is a consortium of 11 universities and research laboratories whose mission is to develop complementary metal-oxide semiconductor (CMOS) active pixel sensors (APS) and to apply these sensors to a range of imaging challenges. A range of sensors has been developed: On-Pixel Intelligent CMOS (OPIC)—designed for in-pixel intelligence; FPN—designed to develop novel techniques for reducing fixed pattern noise; HDR—designed to develop novel techniques for increasing dynamic range; Vanilla/PEAPS—with digital and analogue modes and regions of interest, which has also been back-thinned; Large Area Sensor (LAS)—a novel, stitched LAS; and eLeNA—which develops a range of low noise pixels. Applications being developed include autoradiography, a gamma...
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