CAD and testing of ICs and systems: where are we going?

The purpose of this document is to look at different facets of the development of integrated circuits and systems: CAD from industrial and research viewpoints, and manufacturing cost and its consequences on the development of packaging techniques. Dependability evolution and trends are developed with respect to design verification, production testing and concurrent testing. Also trends in design and technology are addressed, as well as semiconductor technology vs. architecture and European perspectives. A conclusion summarizes the main issues