A diagnosis system devoted to precise failure analysis of complex ICs has been built up by coupling an E-beam tester, a functional tester and a test program generator. A case study illustrates the approach efficiency and the tools flexibility
Today three-dimensional system-in-package integration together with advanced interconnect technologi...
3D integration comes with the introduction of many new processes and materials that may affect behav...
Abstract-This paper reviews Failure Analysis methods and discusses the merits and pitfalls associate...
SIGLECNRS RS 17660 / INIST-CNRS - Institut de l'Information Scientifique et TechniqueFRFranc
ISBN: 0818607262A strategy is derived for failure analysis in random logic devices such as microproc...
Describes a new strategy for failure analysis in random logic devices such as microprocessors and ot...
Attention is given first to the various applications that can take advantage of e-beam testing: insp...
A current research project at IMAG/TIM3 Laboratory aims at developing an integrated test system comb...
As an approach towards automated contactless IC probing we describe a laser beam test system for fai...
The Early Product Learning (EPL) project was started to improve yield and efficiency of ICs and mini...
Failure analysis (FA) is an important function in the development and manufacturing of integrated ci...
We present the results of recent failure analysis of an advanced, 0.5 {mu}m, fully planarized, tripl...
In this paper, several methods are outlined for detecting functional changes in an IC due to externa...
The reduced testability of 3D integrated microelectronic systems poses severe challenges to microstr...
In this paper we will introduce novel methodical approaches for material and failure analysis of 3D ...
Today three-dimensional system-in-package integration together with advanced interconnect technologi...
3D integration comes with the introduction of many new processes and materials that may affect behav...
Abstract-This paper reviews Failure Analysis methods and discusses the merits and pitfalls associate...
SIGLECNRS RS 17660 / INIST-CNRS - Institut de l'Information Scientifique et TechniqueFRFranc
ISBN: 0818607262A strategy is derived for failure analysis in random logic devices such as microproc...
Describes a new strategy for failure analysis in random logic devices such as microprocessors and ot...
Attention is given first to the various applications that can take advantage of e-beam testing: insp...
A current research project at IMAG/TIM3 Laboratory aims at developing an integrated test system comb...
As an approach towards automated contactless IC probing we describe a laser beam test system for fai...
The Early Product Learning (EPL) project was started to improve yield and efficiency of ICs and mini...
Failure analysis (FA) is an important function in the development and manufacturing of integrated ci...
We present the results of recent failure analysis of an advanced, 0.5 {mu}m, fully planarized, tripl...
In this paper, several methods are outlined for detecting functional changes in an IC due to externa...
The reduced testability of 3D integrated microelectronic systems poses severe challenges to microstr...
In this paper we will introduce novel methodical approaches for material and failure analysis of 3D ...
Today three-dimensional system-in-package integration together with advanced interconnect technologi...
3D integration comes with the introduction of many new processes and materials that may affect behav...
Abstract-This paper reviews Failure Analysis methods and discusses the merits and pitfalls associate...
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