Proceedings on 7th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC 2001), September 24-27, 2001, Paris, France

ISBN: 2-913329-72-1THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronics microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The high element density of MCMs, the growing power dissipated in a package, etc., and the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system