Proceedings of Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2008), Cannes, France, April 9-11

ISBN : 978-2-3550-0006-5The Design, Test, Integration and Packaging conferences are a series of annual unique single-meeting events expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. The goal of the Conferences is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and system