Topics
.png%3Fwidth%3D300&w=3840&q=75)
networks-on-chipSoftware
International audienceNowadays 3D chips are fabricated by stacking 2D layers and manufacturing vertical links between them. In this paper we present a routing scheme suited for 3D networks-on-chip (NoCs). It is based on the reuse of existing routing schemes for 2D NoCs. Our 3D scheme is scalable and can be used with any 2D topology. The effectiveness of the scheme for intra-layer communication is given by the respective 2D routing scheme of each layer, while for the inter-layer communication the scheme can always find a route between any source and destination, if there is one available
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
Three dimensional Networks-on-Chip (3D NoCs) have attracted a growing interest to solve on-chip comm...
This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlight...
International audienceExisting routing algorithms for 3D deal with regular mesh/torus 3D topologies....
AbstractNetwork-on-Chip (NoC) has been recognized as an effective solution for complex on-chip commu...
International audienceIn this paper, we propose a distributed routing algorithm for vertically parti...
International audienceStacked 3D integration emerged as a key technology for high performance and lo...
3D ICs can take advantage of a scalable communication platform, commonly referred to as the Networks...
Three-dimensional integrated circuits are a promising approach to push beyond the integration issues...
Network-on-Chip (NoC) is a new approach for designing the communication subsystem among IP cores in ...
ISBN 978-1-4673-2234-8International audienceIn this paper, we detail the design and implementation o...
none3Three-dimensional (3D) manufacturing technologies are viewed as promising solutions to the ban...
Due to high performance demands of the consumer electronics and processing systems, like servers, th...
Three-dimensional Network-On-Chips (3D NOC) are the most efficient communication structures for comp...
SummaryDue to high performance demands of the consumer electronics and processing systems, like serv...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
Three dimensional Networks-on-Chip (3D NoCs) have attracted a growing interest to solve on-chip comm...
This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlight...
International audienceExisting routing algorithms for 3D deal with regular mesh/torus 3D topologies....
AbstractNetwork-on-Chip (NoC) has been recognized as an effective solution for complex on-chip commu...
International audienceIn this paper, we propose a distributed routing algorithm for vertically parti...
International audienceStacked 3D integration emerged as a key technology for high performance and lo...
3D ICs can take advantage of a scalable communication platform, commonly referred to as the Networks...
Three-dimensional integrated circuits are a promising approach to push beyond the integration issues...
Network-on-Chip (NoC) is a new approach for designing the communication subsystem among IP cores in ...
ISBN 978-1-4673-2234-8International audienceIn this paper, we detail the design and implementation o...
none3Three-dimensional (3D) manufacturing technologies are viewed as promising solutions to the ban...
Due to high performance demands of the consumer electronics and processing systems, like servers, th...
Three-dimensional Network-On-Chips (3D NOC) are the most efficient communication structures for comp...
SummaryDue to high performance demands of the consumer electronics and processing systems, like serv...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
Three dimensional Networks-on-Chip (3D NoCs) have attracted a growing interest to solve on-chip comm...
This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlight...
Add to ORKG