ISBN 978-1-4673-2234-8International audienceIn this paper, we detail the design and implementation of a router for vertically-partially-connected 3D-NoCs based on stacked 2D-meshes. This router implements the necessary hardware to support a recently introduced routing algorithm called "Elevator-First", which targets topologies with irregularly placed vertical connections in a deadlock free manner, using only two virtual channels in the plane. The micro-architectural design shows that the proposed router requires few additional hardware. Our studies about the practicality of the algorithm and its router implementation demonstrate that it has low overhead compared to a router for fully connected 3D-NoCs. Using ST Microelectronics 65nm CMOS te...
Abstract—Three-dimensional (3D) integration offers greater device integration, reduced signal delay ...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
International audienceNowadays 3D chips are fabricated by stacking 2D layers and manufacturing verti...
Utilization of the third dimension can lead to a significant reduction in power and average hop-coun...
International audienceIn this paper, we propose a distributed routing algorithm for vertically parti...
With the use of multi-core architectures, the Network-on-Chip (NoC) became an important research top...
L'utilisation de la troisième dimension peut entraîner une réduction significative de la puissance e...
International audienceExisting routing algorithms for 3D deal with regular mesh/torus 3D topologies....
ISBN 978-1-4577-0803-9International audienceThis paper details the design and implementation of an a...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
3D ICs can take advantage of a scalable communication platform, commonly referred to as the Networks...
none3Three-dimensional (3D) manufacturing technologies are viewed as promising solutions to the ban...
AbstractNetwork-on-Chip (NoC) has been recognized as an effective solution for complex on-chip commu...
ISBN :8-1-4419-7617-8The shrinking of processing technology in the deep submicron domain aggravates ...
International audience3D integration opens up new opportunities for future multiprocessor chips by e...
Abstract—Three-dimensional (3D) integration offers greater device integration, reduced signal delay ...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
International audienceNowadays 3D chips are fabricated by stacking 2D layers and manufacturing verti...
Utilization of the third dimension can lead to a significant reduction in power and average hop-coun...
International audienceIn this paper, we propose a distributed routing algorithm for vertically parti...
With the use of multi-core architectures, the Network-on-Chip (NoC) became an important research top...
L'utilisation de la troisième dimension peut entraîner une réduction significative de la puissance e...
International audienceExisting routing algorithms for 3D deal with regular mesh/torus 3D topologies....
ISBN 978-1-4577-0803-9International audienceThis paper details the design and implementation of an a...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
3D ICs can take advantage of a scalable communication platform, commonly referred to as the Networks...
none3Three-dimensional (3D) manufacturing technologies are viewed as promising solutions to the ban...
AbstractNetwork-on-Chip (NoC) has been recognized as an effective solution for complex on-chip commu...
ISBN :8-1-4419-7617-8The shrinking of processing technology in the deep submicron domain aggravates ...
International audience3D integration opens up new opportunities for future multiprocessor chips by e...
Abstract—Three-dimensional (3D) integration offers greater device integration, reduced signal delay ...
In recent years, the enhancement of microchip technologies has enabled large scale Systems-on-Chip (...
International audienceNowadays 3D chips are fabricated by stacking 2D layers and manufacturing verti...