With the increasing density of features in the various integrated circuits surrounding us, 3D integration (stacking chips) becomes essential. One key point of such integration is the metallization of Through Silicon Vias (TSV) connecting two chips together: the aspect ratio of these TSV will be higher than 20 in the near future. The copper-diffusion barrier layer and seed layer for the electrodeposition of copper are currently deposited by physical vapour deposition, and this technique is limited in terms of conformality in high aspect ratio structure. This work focuses on the development of the Atomic Layer Deposition (ALD) of copper and tantalum nitride in order to propose conformal deposition method of barrier and seed layers. Copper pre...
The increasing diversity of devices and services makes the engineering of user interfaces (UI) more ...
Réalisées au début du processus de fabrication des circuits intégrés, les tranchées d'isolation perm...
The fabrication of devices in microelectronics today involves a three-dimensional architecture: "3D ...
Avec l augmentation de la densité de fonctionnalités dans les différents circuits intégrés nous ento...
Integrated circuits density never stopped rising since the discovery of the transistor in 1947, thro...
Emerging innovative technologies from the semiconductor industry in other various industrials activi...
This work takes place in the context of the development of high crystalline quality supports for opt...
Integrated circuits density never stopped rising since the discovery of the transistor in 1947, thro...
The semiconductor industry is driven by an increasing need of computation speed and functionalities....
Photovoltaic conversion is a promising energy resource. Bulk crystalline silicon technologies curren...
This thesis aims to master the MPCVD synthesis of heteroepitaxial diamond films of high crystalline ...
Nowadays, 2D integration shows serious limitations when it comes to manufacturing devices with incre...
Development of innovative biodegradable, edible and functionalized material comes from a triple soci...
Low Pressure Cold Spray is an emerging thermalspraying process increasingly appreciated in the indus...
The requirements for future dynamic random access memory (DRAM) capacitors are summarized in the Int...
The increasing diversity of devices and services makes the engineering of user interfaces (UI) more ...
Réalisées au début du processus de fabrication des circuits intégrés, les tranchées d'isolation perm...
The fabrication of devices in microelectronics today involves a three-dimensional architecture: "3D ...
Avec l augmentation de la densité de fonctionnalités dans les différents circuits intégrés nous ento...
Integrated circuits density never stopped rising since the discovery of the transistor in 1947, thro...
Emerging innovative technologies from the semiconductor industry in other various industrials activi...
This work takes place in the context of the development of high crystalline quality supports for opt...
Integrated circuits density never stopped rising since the discovery of the transistor in 1947, thro...
The semiconductor industry is driven by an increasing need of computation speed and functionalities....
Photovoltaic conversion is a promising energy resource. Bulk crystalline silicon technologies curren...
This thesis aims to master the MPCVD synthesis of heteroepitaxial diamond films of high crystalline ...
Nowadays, 2D integration shows serious limitations when it comes to manufacturing devices with incre...
Development of innovative biodegradable, edible and functionalized material comes from a triple soci...
Low Pressure Cold Spray is an emerging thermalspraying process increasingly appreciated in the indus...
The requirements for future dynamic random access memory (DRAM) capacitors are summarized in the Int...
The increasing diversity of devices and services makes the engineering of user interfaces (UI) more ...
Réalisées au début du processus de fabrication des circuits intégrés, les tranchées d'isolation perm...
The fabrication of devices in microelectronics today involves a three-dimensional architecture: "3D ...