International audienceHigh Speed Serial Links (HSSL) are found in almost all today's System-on-Chip (SoC) connecting different components: the main chip and its I/Os, chip to chip (the main chip to a companion chip, memory sharing between two chips), etc... A variety of standards exist, each of which is used for a specific application, and many parameters affect their performance. In this paper we make a comparison of three high-speed protocols, the USB 3.0, PCI Express 2.0 (PCIe) and LLI 1.0. We analyze their different parameters, mainly the data exchange protocol, errors management, the Bit Error Rate (BER), data efficiency and the quality of service (QoS) for each of the protocols. We also show the relation between these parameters and h...
In line with current technological developments, particularly in the field of hardwarethat has made ...
Abstract- The need for SuperSpeed data communication leads to the use of USB 3.0. USB 3.0 utilizes d...
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Compute...
Data transfers are handled by the computer bus which connects the device to the memory. The data bus...
Connectivity between broad range of devices is today one of the key components on which developers o...
PCI Express is a ubiquitous bus interface providing the highest bandwidth connection in the PC platf...
SerDes (serializer/deserializer) transceiver blocks are used in high-speed serial links. The seriali...
Nowadays there are a lot of things done by machines. Often these machines make use of communication ...
With the development of artificial intelligence technology and heterogeneous computing, heterogeneou...
Although multiple data link protocols that can handle 10's of Gbps have been developed over the year...
In this paper a review on USB2.0 using this innovative approach presented the authors own concept o...
Abstract- This paper discusses the development of PCI Express Interface used for high speed data tra...
University of Minnesot Ph.D. dissertation. November 2008. Major: Electrical Engineering. Advisor: Dr...
The increasing demand for more and more computing power causes steady advancements of High Performan...
PCI Express(PCIe) is a packet-based, serial, interconnect standard that is widely deployed within se...
In line with current technological developments, particularly in the field of hardwarethat has made ...
Abstract- The need for SuperSpeed data communication leads to the use of USB 3.0. USB 3.0 utilizes d...
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Compute...
Data transfers are handled by the computer bus which connects the device to the memory. The data bus...
Connectivity between broad range of devices is today one of the key components on which developers o...
PCI Express is a ubiquitous bus interface providing the highest bandwidth connection in the PC platf...
SerDes (serializer/deserializer) transceiver blocks are used in high-speed serial links. The seriali...
Nowadays there are a lot of things done by machines. Often these machines make use of communication ...
With the development of artificial intelligence technology and heterogeneous computing, heterogeneou...
Although multiple data link protocols that can handle 10's of Gbps have been developed over the year...
In this paper a review on USB2.0 using this innovative approach presented the authors own concept o...
Abstract- This paper discusses the development of PCI Express Interface used for high speed data tra...
University of Minnesot Ph.D. dissertation. November 2008. Major: Electrical Engineering. Advisor: Dr...
The increasing demand for more and more computing power causes steady advancements of High Performan...
PCI Express(PCIe) is a packet-based, serial, interconnect standard that is widely deployed within se...
In line with current technological developments, particularly in the field of hardwarethat has made ...
Abstract- The need for SuperSpeed data communication leads to the use of USB 3.0. USB 3.0 utilizes d...
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Compute...