textSilicon based 3D fin structure is believed to be the potential future of current semiconductor technology. However, there are significant challenges still exist in realizing a manufacturable fin based process. In this work, we have studied the effects of hydrogen anneal on the structural and electrical characteristics of silicon fin based devices: tri-gate, finFET to name a few. H₂ anneal is shown to play a major role in structural integrity and manufacturability of 3D fin structure which is the most critical feature for these types of devices. Both the temperature and the pressure of H₂ anneal can result in significant alteration of fin height and shape as well as electrical characteristics. Optimum H₂ anneal is required in order to im...
none3noWhile traditional scaling used to be accompanied by an improvement in device performance, thi...
FinFET prototypes have been fabricated using an aluminium hard mask FIB milling technique for fin de...
The architecture, size and density of metal oxide field effect transistors (MOSFETs) as unit bricks ...
textSilicon based 3D fin structure is believed to be the potential future of current semiconductor t...
To continue the scaling of CMOS technology to 65 nm node and beyond, FinFET double-gate device struc...
MOSFETs with multiple gate structures, such as 3-D FinFETs have seen enormous interest for sub-22 nm...
A Tn Gated Fin Field Effect Transistor is on of the many novel devices that may be replacing planar ...
This letter reports a study on the effect of a hydrogen anneal after silicon pillar etch of surround...
Three-dimensional (3D) statistical simulation is presented to propose using triple-gate (TG) fin fie...
Three-dimensional (3D) statistical simulation is presented to propose using triple-gate (TG) fin fie...
Abstract An innovative technology named FinFET (Fin Field Effect Transistor) has been developed to ...
The Semiconductor industry has excelled the electronics market in providing high speed, power effici...
The Effect of Post Deposition Annealing (PDA) is important for Metal Oxide Semiconductor(MOS) Device...
Technology scaling below 22 nm has brought several detrimental effects such as increased short chann...
This paper presents an investigation on properties of Double Gate FinFET (DG-FinFET) and impact of p...
none3noWhile traditional scaling used to be accompanied by an improvement in device performance, thi...
FinFET prototypes have been fabricated using an aluminium hard mask FIB milling technique for fin de...
The architecture, size and density of metal oxide field effect transistors (MOSFETs) as unit bricks ...
textSilicon based 3D fin structure is believed to be the potential future of current semiconductor t...
To continue the scaling of CMOS technology to 65 nm node and beyond, FinFET double-gate device struc...
MOSFETs with multiple gate structures, such as 3-D FinFETs have seen enormous interest for sub-22 nm...
A Tn Gated Fin Field Effect Transistor is on of the many novel devices that may be replacing planar ...
This letter reports a study on the effect of a hydrogen anneal after silicon pillar etch of surround...
Three-dimensional (3D) statistical simulation is presented to propose using triple-gate (TG) fin fie...
Three-dimensional (3D) statistical simulation is presented to propose using triple-gate (TG) fin fie...
Abstract An innovative technology named FinFET (Fin Field Effect Transistor) has been developed to ...
The Semiconductor industry has excelled the electronics market in providing high speed, power effici...
The Effect of Post Deposition Annealing (PDA) is important for Metal Oxide Semiconductor(MOS) Device...
Technology scaling below 22 nm has brought several detrimental effects such as increased short chann...
This paper presents an investigation on properties of Double Gate FinFET (DG-FinFET) and impact of p...
none3noWhile traditional scaling used to be accompanied by an improvement in device performance, thi...
FinFET prototypes have been fabricated using an aluminium hard mask FIB milling technique for fin de...
The architecture, size and density of metal oxide field effect transistors (MOSFETs) as unit bricks ...