textThe scaling required to accommodate faster chip performance in microelectronic devices has necessitated a reduction in the dimensions of copper interconnects at the back end of the line. The constant downscaling of copper interconnects has resulted in changes to the microstructure, and these variations are known to impact electrical resistivity and reliability issues in interconnects. In this work, a novel electron diffraction technique called Diffraction Scanning Transmission Electron Microscopy (D-STEM) has been developed and coupled with precession electron microscopy to obtain quantitative local texture information in damascene copper lines (1.8 \mu m to 70 nm in width) with a spatial resolution of less than 5 nm. Misorientation a...
The continued scaling of Cu low k technology is facing serious challenges imposed by basic limits fr...
International audienceFine Cu interconnects possess small grains that increase the electrical resist...
We have characterized grain boundary structures and local textures in stress voided copper lines. Gr...
The effect of line scaling on Cu grain structures has been investigated by using both plan-view and ...
International audienceIn this article, we focus on the possible influence of interconnect Cu microst...
International audienceIn this article, we focus on the possible influence of interconnect Cu microst...
International audienceIn this article, we focus on the possible influence of interconnect Cu microst...
International audienceThe evolution of the grain structure through annealing of narrow damascene Cu ...
International audienceThe evolution of the grain structure through annealing of narrow damascene Cu ...
International audienceThe evolution of the grain structure through annealing of narrow damascene Cu ...
International audienceThe evolution of the grain structure through annealing of narrow damascene Cu ...
International audienceThe evolution of the grain structure through annealing of narrow damascene Cu ...
Recently Al was replaced by Cu as an interconnecting material. The primary objective of the present ...
Transmission electron microscope (TEM) is used in conjunction with an Automated Crystallography for ...
International audienceFine Cu interconnects possess small grains that increase the electrical resist...
The continued scaling of Cu low k technology is facing serious challenges imposed by basic limits fr...
International audienceFine Cu interconnects possess small grains that increase the electrical resist...
We have characterized grain boundary structures and local textures in stress voided copper lines. Gr...
The effect of line scaling on Cu grain structures has been investigated by using both plan-view and ...
International audienceIn this article, we focus on the possible influence of interconnect Cu microst...
International audienceIn this article, we focus on the possible influence of interconnect Cu microst...
International audienceIn this article, we focus on the possible influence of interconnect Cu microst...
International audienceThe evolution of the grain structure through annealing of narrow damascene Cu ...
International audienceThe evolution of the grain structure through annealing of narrow damascene Cu ...
International audienceThe evolution of the grain structure through annealing of narrow damascene Cu ...
International audienceThe evolution of the grain structure through annealing of narrow damascene Cu ...
International audienceThe evolution of the grain structure through annealing of narrow damascene Cu ...
Recently Al was replaced by Cu as an interconnecting material. The primary objective of the present ...
Transmission electron microscope (TEM) is used in conjunction with an Automated Crystallography for ...
International audienceFine Cu interconnects possess small grains that increase the electrical resist...
The continued scaling of Cu low k technology is facing serious challenges imposed by basic limits fr...
International audienceFine Cu interconnects possess small grains that increase the electrical resist...
We have characterized grain boundary structures and local textures in stress voided copper lines. Gr...