International audienceParallel micro/mini-channel heat sinks are widely used for the efficient cooling of electronic devices to avoid functional damage and lifetime shortening due to overheating. This study addresses the optimization of fluid flow distribution in parallel mini-channel heat sinks subjected to a non-uniform multiple-peak heat flux to eliminate the temperature hotspots. A 3D heat sink comprising of 16 parallel straight mini-channels is used as a model for study, each mini-channel having the dimension of 1 mm in width, 2 mm in height and 34 mm in length. In particular, an original optimization algorithm is developed to adjust the inlets of these mini-channels according to the temperature distribution on the heating base surface...
A numerical optimization tool is used to optimize forced convection micro-channel heat sinks for min...
Demands for increased functionality from mobile electronic products have led to an increase in the a...
AbstractThe configuration sizes of multi-layer microchannel heat sink is optimized in order to enhan...
This paper presents a detailed literature review on the thermal management issue faced by electronic...
The cooling of electronic devices is essential to guarantee their functional performance and operati...
Application requirements for avionics are often very strict. For example, the heat sinks of avionics...
Purpose - With the development of electronic devices, including the desires of integration, miniatur...
Micro-channel heats sinks are gradually replacing conventional fan heat sinks for electronic chip co...
In electronics cooling, it is vital to remove a high amount of heat from electronic components withi...
Dimensional optimization of silicon microchannel heat sinks is performed by minimizing the total the...
This paper documents the geometrical optimization of a micro-channel heatsink embedded inside a high...
Cooling of electronic devices is problematic by its nature simply because of the space restriction. ...
Increased heat dissipation rates from electronic chips creates the need for high heat flux cooling s...
A simple thermal resistance network model is developed to optimize the overall thermal performance o...
In this paper a numerical analysis of three-dimensional laminar flow through rectangular channel hea...
A numerical optimization tool is used to optimize forced convection micro-channel heat sinks for min...
Demands for increased functionality from mobile electronic products have led to an increase in the a...
AbstractThe configuration sizes of multi-layer microchannel heat sink is optimized in order to enhan...
This paper presents a detailed literature review on the thermal management issue faced by electronic...
The cooling of electronic devices is essential to guarantee their functional performance and operati...
Application requirements for avionics are often very strict. For example, the heat sinks of avionics...
Purpose - With the development of electronic devices, including the desires of integration, miniatur...
Micro-channel heats sinks are gradually replacing conventional fan heat sinks for electronic chip co...
In electronics cooling, it is vital to remove a high amount of heat from electronic components withi...
Dimensional optimization of silicon microchannel heat sinks is performed by minimizing the total the...
This paper documents the geometrical optimization of a micro-channel heatsink embedded inside a high...
Cooling of electronic devices is problematic by its nature simply because of the space restriction. ...
Increased heat dissipation rates from electronic chips creates the need for high heat flux cooling s...
A simple thermal resistance network model is developed to optimize the overall thermal performance o...
In this paper a numerical analysis of three-dimensional laminar flow through rectangular channel hea...
A numerical optimization tool is used to optimize forced convection micro-channel heat sinks for min...
Demands for increased functionality from mobile electronic products have led to an increase in the a...
AbstractThe configuration sizes of multi-layer microchannel heat sink is optimized in order to enhan...