In this work, Sn-Cu composite powders were produced using an electroless process. The tin content on the surface of copper powders was varied by using different concentrations of SnSO₄ in the plating bath. The surface morphology of the produced Sn-Cu composite powders was characterized using scanning electron microscopy (SEM). Energy dispersive spectroscopy (EDS) was used to determine the elemental surface composition of the composites. X-ray diffraction (XRD) analysis was performed to investigate the structure of the Sn-Cu composite powders. The electrochemical performance of Sn-Cu nanocomposites was studied by charge/discharge tests
Enforced solid solution type Sn-Zn alloy films were electrochemically synthesized on Cu substrate fr...
The purpose of this study is to identify theZn2+ions concentrationat Sn-Zn coating which could be pr...
The electrodeposition of Cu-Zn-Sn alloys from a commercial alkaline cyanide bath has been investigat...
In this work, Sn-Cu composite powders were produced using an electroless process. The tin content on...
In this article, the electrodeposition process of Cu-Sn alloy powders from tripolyphosphate (TPP)-ba...
Cu-Zn-Sn shape memory alloy was prepared using electrodeless technique. Compared to other methods, t...
Spherical hollow Cu6Sn5/C composite powders are prepared by a post-treatment of the precursor powder...
Silicon nitride particles were incorporated to electrolytic copper by co-electrodeposition in acidic...
Nanostructured lead-free solder Sn-Ag-Cu (SAC) was developed by electrodeposition method at room tem...
<div><p>This work proposes the production of Cu-Sn alloy coatings with anticorrosive properties, usi...
Films of nanometric Cu-Sn intermetallic compounds have been prepared by electrodeposition under spon...
WOS: 000271542900033Copper-tin alloy films were galvanostatically electrodeposited on the mild steel...
AbstractSmooth copper coatings containing well-distributed silicon nitride particles were obtained b...
The constant tendency of miniaturization in electronic products and developments in surface assembly...
Smooth copper coatings containing well-distributed silicon nitride particles were obtained by co-ele...
Enforced solid solution type Sn-Zn alloy films were electrochemically synthesized on Cu substrate fr...
The purpose of this study is to identify theZn2+ions concentrationat Sn-Zn coating which could be pr...
The electrodeposition of Cu-Zn-Sn alloys from a commercial alkaline cyanide bath has been investigat...
In this work, Sn-Cu composite powders were produced using an electroless process. The tin content on...
In this article, the electrodeposition process of Cu-Sn alloy powders from tripolyphosphate (TPP)-ba...
Cu-Zn-Sn shape memory alloy was prepared using electrodeless technique. Compared to other methods, t...
Spherical hollow Cu6Sn5/C composite powders are prepared by a post-treatment of the precursor powder...
Silicon nitride particles were incorporated to electrolytic copper by co-electrodeposition in acidic...
Nanostructured lead-free solder Sn-Ag-Cu (SAC) was developed by electrodeposition method at room tem...
<div><p>This work proposes the production of Cu-Sn alloy coatings with anticorrosive properties, usi...
Films of nanometric Cu-Sn intermetallic compounds have been prepared by electrodeposition under spon...
WOS: 000271542900033Copper-tin alloy films were galvanostatically electrodeposited on the mild steel...
AbstractSmooth copper coatings containing well-distributed silicon nitride particles were obtained b...
The constant tendency of miniaturization in electronic products and developments in surface assembly...
Smooth copper coatings containing well-distributed silicon nitride particles were obtained by co-ele...
Enforced solid solution type Sn-Zn alloy films were electrochemically synthesized on Cu substrate fr...
The purpose of this study is to identify theZn2+ions concentrationat Sn-Zn coating which could be pr...
The electrodeposition of Cu-Zn-Sn alloys from a commercial alkaline cyanide bath has been investigat...