In this study, different types of whisker-like formations of Sn-3.0Ag based alloy were presented. In the experimental process the amount of Pb element was changed between 1000 and 2000 ppm, and the furnace atmosphere and cooling rate were also modified. The novelty of this work was that whisker-like formations in macro scale size were experienced after an exothermic reaction. The whiskers of larger sizes than general provided opportunities to investigate the microstructure and the concentration nearby the whiskers. In addition, the whisker-like formations from Sn-Ag based bulk material did not only consist of pure tin but tin and silver phases. The whisker-like growth appeared in several forms including hillock, spire and nodule shaped form...
Eutectic structures in Ag-based brazing filler metals play an important role in improving the proper...
The use of formic acid vapor in soldering is growing. In the presence of SnAgCu powder, used as a b...
The clarification of whisker growth mechanism is a key to the mitigation of tin-whiskers. In order t...
In this study, different types of whisker-like formations of Sn-3.0Ag based alloy were presented. In...
In this paper, the relationship between the crystallographic structure of Cu-Sn intermetallic grains...
Tin (Sn) whiskers are conductive Sn filaments that grow from Sn-plated surfaces, such as surface fin...
The elucidation of spontaneous growth of metal whiskers from metal surfaces is still ongoing, with t...
Abstract — The global move toward reducing the usage of lead in electronics manufacturing industry i...
Standard Leadframes used in surface mount technology are finished with a layer of eutectic SnPb for...
The changes of microstructure in pure-Sn after deformation were investigated by electron microscopy....
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to...
The current work is aimed at analyzing the effects of crystallographic texture, both macro and micro...
Tin whiskers and hillocks grow spontaneously from the surfaces of polycrystalline Sn films at room t...
The 3D microstructure around a tin whisker, and its evolution during heat treatment were studied usi...
Driven by environmental concerns and the enforcement of Restriction of Hazardous Substances Directiv...
Eutectic structures in Ag-based brazing filler metals play an important role in improving the proper...
The use of formic acid vapor in soldering is growing. In the presence of SnAgCu powder, used as a b...
The clarification of whisker growth mechanism is a key to the mitigation of tin-whiskers. In order t...
In this study, different types of whisker-like formations of Sn-3.0Ag based alloy were presented. In...
In this paper, the relationship between the crystallographic structure of Cu-Sn intermetallic grains...
Tin (Sn) whiskers are conductive Sn filaments that grow from Sn-plated surfaces, such as surface fin...
The elucidation of spontaneous growth of metal whiskers from metal surfaces is still ongoing, with t...
Abstract — The global move toward reducing the usage of lead in electronics manufacturing industry i...
Standard Leadframes used in surface mount technology are finished with a layer of eutectic SnPb for...
The changes of microstructure in pure-Sn after deformation were investigated by electron microscopy....
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to...
The current work is aimed at analyzing the effects of crystallographic texture, both macro and micro...
Tin whiskers and hillocks grow spontaneously from the surfaces of polycrystalline Sn films at room t...
The 3D microstructure around a tin whisker, and its evolution during heat treatment were studied usi...
Driven by environmental concerns and the enforcement of Restriction of Hazardous Substances Directiv...
Eutectic structures in Ag-based brazing filler metals play an important role in improving the proper...
The use of formic acid vapor in soldering is growing. In the presence of SnAgCu powder, used as a b...
The clarification of whisker growth mechanism is a key to the mitigation of tin-whiskers. In order t...