In this work, mechanical properties of Cu-to-Cu joint samples prepared by low temperature sintering of Ag nanoparticle paste have been investigated. The silver nanopaste was prepared by a controlled thermal decomposition of an organometallic precursor. The as-synthesized Ag particles were spherical, with an average diameter of 8.5 nm. The Cu-to-Cu joint samples were made by placing a small amount of Ag nanopaste between two polished Cu plates and sintering at 150C, 200C, 220C and 350C in air. A normal load was applied to aid sintering. Mechanical properties were measured by imposing a uniform stress across the sample bond area and measuring the corresponding strain. The application of external load was found to have a positive effect on the...
To date, additions of different oxide nanoparticles is one of the most widespread procedures to impr...
Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan mencampurkan nanopartikel Ag dan Cu de...
The samples of sintered Ag joints for power die attachments were prepared using paste of Ag nanopart...
Metallic nanoparticles have the particularity to sinter at lower temperatures compared to microparti...
A silver-copper (Ag-Cu) nanopaste formulated by mixing Ag and Cu nanoparticles with organic additive...
In this work, thermal characteristic of silver-copper (Ag-Cu) nanopaste that consists of a mixture o...
The present dissertation is motivated by the search for alternatives of lead-free soldering by nanop...
Addition of lead into tin based solders represents a serious health risk and environmental problem. ...
Abstract A reliable Cu–Cu bonding joint was achieved by using the highly sinterable Cu nanoparticle ...
Electronic devices used for extreme high temperature (>500oC) for instance in aviation and aerospac...
Power electronics demand miniaturization, integration, higher electrical and ther-mal conductivities...
Les nanoparticules métalliques ont la particularité de fritter à des températures bien inférieures q...
In this paper, the microstructure of Ag nano paste joint was investigated in pressure-less sintering...
Ag nanoparticle paste is prepared based on the polyol method and subsequent concentration by centrif...
To support the harsh environment of power electronics, such as high operating temperature, and high ...
To date, additions of different oxide nanoparticles is one of the most widespread procedures to impr...
Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan mencampurkan nanopartikel Ag dan Cu de...
The samples of sintered Ag joints for power die attachments were prepared using paste of Ag nanopart...
Metallic nanoparticles have the particularity to sinter at lower temperatures compared to microparti...
A silver-copper (Ag-Cu) nanopaste formulated by mixing Ag and Cu nanoparticles with organic additive...
In this work, thermal characteristic of silver-copper (Ag-Cu) nanopaste that consists of a mixture o...
The present dissertation is motivated by the search for alternatives of lead-free soldering by nanop...
Addition of lead into tin based solders represents a serious health risk and environmental problem. ...
Abstract A reliable Cu–Cu bonding joint was achieved by using the highly sinterable Cu nanoparticle ...
Electronic devices used for extreme high temperature (>500oC) for instance in aviation and aerospac...
Power electronics demand miniaturization, integration, higher electrical and ther-mal conductivities...
Les nanoparticules métalliques ont la particularité de fritter à des températures bien inférieures q...
In this paper, the microstructure of Ag nano paste joint was investigated in pressure-less sintering...
Ag nanoparticle paste is prepared based on the polyol method and subsequent concentration by centrif...
To support the harsh environment of power electronics, such as high operating temperature, and high ...
To date, additions of different oxide nanoparticles is one of the most widespread procedures to impr...
Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan mencampurkan nanopartikel Ag dan Cu de...
The samples of sintered Ag joints for power die attachments were prepared using paste of Ag nanopart...