International audienceThe copper rich corner of the CuNiSn system is frequently studied for the high tensile strength and good electrical conductivity of the alloys. In this study, we focus on the phase transformations at high temperature. The incipient melting is studied in some detail just below 1000 °C since the presence of an unexpected peak at 985 °C on the DTA's thermograms is detected
This paper presents the use of the transient liquid phase concept to grow the high temperature CuSni...
The fracture toughness of bulk Sn, Sn-Cu, Sn-Ag and Sn-Ag-Cu lead-free solders was measured as funct...
CuSn exists at least in two crystal structures with an allotropic transformation from monoclinic η'-...
CuSn is an important intermetallic for electric interconnects and anode material of Li-ion batteries...
AbstractPhase diagram investigation of the Cu–Sn system was carried out on twenty Cu-rich samples by...
Cu Sn is a critical intermetallic compound in soldering operations. Conventional equilibrium phase d...
Several physical properties (density, viscosity, ultrasound velocity, electroresistivity and magneti...
The intermetallic compound Cu Sn is a significant microstructural feature of many electronic devices...
AbstractPhase diagram investigation of the Cu–Sn system was carried out on twenty Cu-rich samples by...
CuSn is an important intermetallic compound used in lead-free soldering and anode materials for Li-i...
The ternary Cu-Al-Sn phase diagram is the base for several important types of alloys, with releva...
Phase relations in the ternary system Cu-Ni-S were investigated using 275 samples in evacuated quart...
The transformations of a Cu-10wt%Ni-5.5wt%Sn alloy as a function of the aging time in the range from...
a b s t r a c t Phase diagram investigation of the CueSn system was carried out on twenty Cu-rich sa...
The crystal structure and transformation behaviour of different phases in copper-tin alloys having 1...
This paper presents the use of the transient liquid phase concept to grow the high temperature CuSni...
The fracture toughness of bulk Sn, Sn-Cu, Sn-Ag and Sn-Ag-Cu lead-free solders was measured as funct...
CuSn exists at least in two crystal structures with an allotropic transformation from monoclinic η'-...
CuSn is an important intermetallic for electric interconnects and anode material of Li-ion batteries...
AbstractPhase diagram investigation of the Cu–Sn system was carried out on twenty Cu-rich samples by...
Cu Sn is a critical intermetallic compound in soldering operations. Conventional equilibrium phase d...
Several physical properties (density, viscosity, ultrasound velocity, electroresistivity and magneti...
The intermetallic compound Cu Sn is a significant microstructural feature of many electronic devices...
AbstractPhase diagram investigation of the Cu–Sn system was carried out on twenty Cu-rich samples by...
CuSn is an important intermetallic compound used in lead-free soldering and anode materials for Li-i...
The ternary Cu-Al-Sn phase diagram is the base for several important types of alloys, with releva...
Phase relations in the ternary system Cu-Ni-S were investigated using 275 samples in evacuated quart...
The transformations of a Cu-10wt%Ni-5.5wt%Sn alloy as a function of the aging time in the range from...
a b s t r a c t Phase diagram investigation of the CueSn system was carried out on twenty Cu-rich sa...
The crystal structure and transformation behaviour of different phases in copper-tin alloys having 1...
This paper presents the use of the transient liquid phase concept to grow the high temperature CuSni...
The fracture toughness of bulk Sn, Sn-Cu, Sn-Ag and Sn-Ag-Cu lead-free solders was measured as funct...
CuSn exists at least in two crystal structures with an allotropic transformation from monoclinic η'-...