Benefits of finer semiconductor device granularity on power converter thermal stress and MTTF

This article explores the thermal and reliability benefits of configuring the power semiconductor block of power converters with several small standard power semiconductor devices instead of a few larger ones at a fixed total chip area. The effectiveness of a finer power semiconductor device granularity is analyzed in the context of a synchronous buck converter design under different operating conditions and employing a recently proposed component, the switching-cell array, to implement the semiconductor-component block of the converter. Comparative evalua tions are undertaken under different degrees of granularity and in terms of semiconductor loss distribution, semiconductor temperature distribution, and converter mean time to failure. The article also discusses the thermo-electrical and reliability models employed, and the assumptions made for a fair and straightforward comparison in a generic case. The comparison results reveal that a finer granularity can potentially provide remarkable benefits, although the incremental improvements decrease as the granularity becomes finer. A tradeoff solution must be sought in each specific case balancing the benefits achieved with the added complexityPostprint (author's final draft