The thermal performance of an interface material comprised of a metal foil with dense, vertically oriented carbon nanotub
The performance of electronic devices has long been limited by thermal dissipation which will result...
International audienceWith progress in microelectronics the component density on a device increases ...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
The development of thermal interface materials (TIMs) is necessitated by the temperature drop across...
The thermal interface layer can be a limiting element in the cooling of microelectronic devices. Con...
This study aims to develop methods to enhance CNT thermal interface performance by engineering the a...
In the last decade, much research has attempted to develop a highly conducting and mechanically reli...
The power density of electronic packages has substantially increased. The thermal interface resistan...
Carbon nanotubes (CNTs) possess extremely high thermal conductivity in the axial direction. To take ...
High performance/small package electronics create difficult thermal issues for integrated circuits. ...
Experimental and theoretical analyses were used to study the effect of thermal contact resistance in...
Heat-conduction interfaces that employ carbon nanotube (CNT) arrays have been fabricated and studied...
Thermal interface material (TIM) is a critical component in thermal management of high density packa...
This thesis describes the synthesis of a low modulus, thermally conductive thermal interface materia...
Electronic Chip cooling has become an important issue with the ever increasing transistor densities ...
The performance of electronic devices has long been limited by thermal dissipation which will result...
International audienceWith progress in microelectronics the component density on a device increases ...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
The development of thermal interface materials (TIMs) is necessitated by the temperature drop across...
The thermal interface layer can be a limiting element in the cooling of microelectronic devices. Con...
This study aims to develop methods to enhance CNT thermal interface performance by engineering the a...
In the last decade, much research has attempted to develop a highly conducting and mechanically reli...
The power density of electronic packages has substantially increased. The thermal interface resistan...
Carbon nanotubes (CNTs) possess extremely high thermal conductivity in the axial direction. To take ...
High performance/small package electronics create difficult thermal issues for integrated circuits. ...
Experimental and theoretical analyses were used to study the effect of thermal contact resistance in...
Heat-conduction interfaces that employ carbon nanotube (CNT) arrays have been fabricated and studied...
Thermal interface material (TIM) is a critical component in thermal management of high density packa...
This thesis describes the synthesis of a low modulus, thermally conductive thermal interface materia...
Electronic Chip cooling has become an important issue with the ever increasing transistor densities ...
The performance of electronic devices has long been limited by thermal dissipation which will result...
International audienceWith progress in microelectronics the component density on a device increases ...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
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