This paper explores the feasibility of using electrostatically actuated diaphragm compressors in a miniature-scale refrigeration system for electronics cooling. A previously developed experimentally validated analytical model for the diaphragm compressor is used in conjunction with an optimization approach to determine the required dimensions for the compressor. The analysis reveals that the pressure rise and volume flow rate required for the electronics cooling application are not achieved using a single compressor because of material property limitations. A three-dimensional array of compressors is proposed instead with which the cooling requirements and the size restrictions for electronics cooling applications may be simultaneously sati...
A good matching between size and efficiency is a desirable design feature of cooling units for elect...
The power density of electronic devices has increased to a level that requires new technology for he...
Maintaining future high performance microprocessor chips within an acceptable operating temperature ...
This paper explores the feasibility of using electrostatically actuated diaphragm compressors in a m...
This paper explores the feasibility of using electrostatically actuated diaphragm compressors in a m...
This paper explores the feasibility of using electrostatically actuated diaphragm compressors in a m...
This paper explores the feasibility of using electrostatically actuated diaphragm compressors in a m...
This paper presents a new analytical approach for quasi-static modeling of an electrostatically actu...
The power density of electronic devices has increased to a level that requires new technology for he...
A comprehensive model of a miniature-scale linear compressor for electronics cooling is presented. L...
Computer chips have generally been cooled by means of a heat sink/fan device; however, such systems ...
Computer chips have generally been cooled by means of a heat sink/fan device; however, such systems ...
Computer chips have generally been cooled by means of a heat sink/fan device; however, such systems ...
A good matching between size and efficiency is a desirable design feature of cooling units for elect...
This paper describes performance measurements on a prototype miniature rotary compressor with refrig...
A good matching between size and efficiency is a desirable design feature of cooling units for elect...
The power density of electronic devices has increased to a level that requires new technology for he...
Maintaining future high performance microprocessor chips within an acceptable operating temperature ...
This paper explores the feasibility of using electrostatically actuated diaphragm compressors in a m...
This paper explores the feasibility of using electrostatically actuated diaphragm compressors in a m...
This paper explores the feasibility of using electrostatically actuated diaphragm compressors in a m...
This paper explores the feasibility of using electrostatically actuated diaphragm compressors in a m...
This paper presents a new analytical approach for quasi-static modeling of an electrostatically actu...
The power density of electronic devices has increased to a level that requires new technology for he...
A comprehensive model of a miniature-scale linear compressor for electronics cooling is presented. L...
Computer chips have generally been cooled by means of a heat sink/fan device; however, such systems ...
Computer chips have generally been cooled by means of a heat sink/fan device; however, such systems ...
Computer chips have generally been cooled by means of a heat sink/fan device; however, such systems ...
A good matching between size and efficiency is a desirable design feature of cooling units for elect...
This paper describes performance measurements on a prototype miniature rotary compressor with refrig...
A good matching between size and efficiency is a desirable design feature of cooling units for elect...
The power density of electronic devices has increased to a level that requires new technology for he...
Maintaining future high performance microprocessor chips within an acceptable operating temperature ...