US 6,251,248 B1USA109/4220922001/06/26A microfabrication process for making a microstructure product comprises: micromachining a polymer substrate for forming a three-dimensional microstructure pattern with deep cavities; shrinking and minimizing the diameter or width of each cavity of the microstructure pattern by steadily swelling the polymer, which is prefixed on a cathode of an electroforming system, by saturating the electrolyte solution into the polymer; electroforming in the electroforming system electrically connected with an anode and the cathode for filling metal in the cavities in the polymer; and desorption of the electrolyte from the polymer to shrink the polymer to be separated from an electroformed microstructure product, and...
In the present study, a separated micromold system (SMS) is newly proposed and developed for an effi...
WO 200138240 A UPAB: 20010822 NOVELTY - Process for structuring surfaces of micromechanical and/or m...
Improving the LIGA technology a method was developed to mold microstructures on processed wafers and...
US 6,221,227 B1USA109/454,066A microfabrication process comprises the swelling of at least a hydroph...
專利國別:美國United States Patent: 6,221,227Application number: 09/454,066國際分類號:C25D 1/00; C25D 1/20; C25D...
Metallic micro devices have advantages over silicon-based microdevices when subjected to high stress...
A method for fabricating a three-dimensional (3D) polymeric microstructure is disclosed. The method ...
A method for fabricating a three-dimensional (3D) polymeric microstructure is disclosed. The method ...
A method for fabricating a three-dimensional (3D) polymeric microstructure is disclosed. The method ...
A method for fabricating a three-dimensional (3D) polymeric microstructure is disclosed. The method ...
Traditional micromanufacturing has been developed for semiconductor industry. Selected micro electri...
Traditional micromanufacturing has been developed for semiconductor industry. Selected micro electri...
Microfluidic devices have been widely used for biomedical and biochemical applications. Due to its u...
Microfluidic devices have been widely used for biomedical and biochemical applications. Due to its u...
Two- or multi-level microstructures are getting more important in several applications such as multi...
In the present study, a separated micromold system (SMS) is newly proposed and developed for an effi...
WO 200138240 A UPAB: 20010822 NOVELTY - Process for structuring surfaces of micromechanical and/or m...
Improving the LIGA technology a method was developed to mold microstructures on processed wafers and...
US 6,221,227 B1USA109/454,066A microfabrication process comprises the swelling of at least a hydroph...
專利國別:美國United States Patent: 6,221,227Application number: 09/454,066國際分類號:C25D 1/00; C25D 1/20; C25D...
Metallic micro devices have advantages over silicon-based microdevices when subjected to high stress...
A method for fabricating a three-dimensional (3D) polymeric microstructure is disclosed. The method ...
A method for fabricating a three-dimensional (3D) polymeric microstructure is disclosed. The method ...
A method for fabricating a three-dimensional (3D) polymeric microstructure is disclosed. The method ...
A method for fabricating a three-dimensional (3D) polymeric microstructure is disclosed. The method ...
Traditional micromanufacturing has been developed for semiconductor industry. Selected micro electri...
Traditional micromanufacturing has been developed for semiconductor industry. Selected micro electri...
Microfluidic devices have been widely used for biomedical and biochemical applications. Due to its u...
Microfluidic devices have been widely used for biomedical and biochemical applications. Due to its u...
Two- or multi-level microstructures are getting more important in several applications such as multi...
In the present study, a separated micromold system (SMS) is newly proposed and developed for an effi...
WO 200138240 A UPAB: 20010822 NOVELTY - Process for structuring surfaces of micromechanical and/or m...
Improving the LIGA technology a method was developed to mold microstructures on processed wafers and...