Na2CO3—1.5 H2O2, KClO3, KMnO4, KIO3, and NaOH were selected for dry polishing tests with a 6H-SiC single crystal substrate on a polyurethane polishing pad. The research results showed that all the solid-phase oxidants, except NaOH, could decompose to produce oxygen under the frictional action. After polishing with the five solid-phase oxidants, oxygen was found on the surface of SiC, indicating that all five solid-phase oxidants can have complex tribochemical reactions with SiC. Their reaction products are mainly SiO2 and (SiO2)x. Under the action of friction, due to the high flash point temperature of the polishing interface, the oxygen generated by the decomposition of the solid-phase oxidant could oxidize the surface of SiC and generate ...
The present study is based on tests with sintered silicon carbide sliding unlubricated on itself in ...
Microcracks inevitably appear on the SiC wafer surface during conventional thinning. It is generally...
Silicon carbide materials are excellent candidates for high-performance applications due to their ou...
.Tribochemical polishing TCP has been applied to finish polycrystalline silicon carbide samples. Wit...
This study focuses on the development of a novel polishing pad for SiC wafers. Fe and Al2O3 particle...
Chemical mechanical polishing (CMP) removal mechanisms of on-axis Si-face SiC wafer have been invest...
Chemical mechanical polishing (CMP) removal mechanisms of on-axis Si-face SiC wafer have been invest...
Due to its high mechanical hardness and excellent chemical inertness, SiC single-crystal wafer is ex...
Abstract Silicon carbide (SiC) can be tribo-chemically smoothened during a self-mated sliding proced...
Abstract Silicon carbide (SiC) wafers have attracted attention as a material for advanced power semi...
We developed an advanced Chemical Mechanical Polishing (CMP) technology for Silicon-Carbide (SiC) si...
Chemical mechanical polishing (CMP) is a well-known technology that can produce surfaces with outsta...
An in-depth understanding of the formation of silicon dioxide (SiO2) on silicon carbide (SiC) in the...
Single crystal silicon carbide is widely used for microelectronics, optoelectronics and medicine sec...
In this study the tribological and hydrothermal behaviour of silicon carbide was examined. No signif...
The present study is based on tests with sintered silicon carbide sliding unlubricated on itself in ...
Microcracks inevitably appear on the SiC wafer surface during conventional thinning. It is generally...
Silicon carbide materials are excellent candidates for high-performance applications due to their ou...
.Tribochemical polishing TCP has been applied to finish polycrystalline silicon carbide samples. Wit...
This study focuses on the development of a novel polishing pad for SiC wafers. Fe and Al2O3 particle...
Chemical mechanical polishing (CMP) removal mechanisms of on-axis Si-face SiC wafer have been invest...
Chemical mechanical polishing (CMP) removal mechanisms of on-axis Si-face SiC wafer have been invest...
Due to its high mechanical hardness and excellent chemical inertness, SiC single-crystal wafer is ex...
Abstract Silicon carbide (SiC) can be tribo-chemically smoothened during a self-mated sliding proced...
Abstract Silicon carbide (SiC) wafers have attracted attention as a material for advanced power semi...
We developed an advanced Chemical Mechanical Polishing (CMP) technology for Silicon-Carbide (SiC) si...
Chemical mechanical polishing (CMP) is a well-known technology that can produce surfaces with outsta...
An in-depth understanding of the formation of silicon dioxide (SiO2) on silicon carbide (SiC) in the...
Single crystal silicon carbide is widely used for microelectronics, optoelectronics and medicine sec...
In this study the tribological and hydrothermal behaviour of silicon carbide was examined. No signif...
The present study is based on tests with sintered silicon carbide sliding unlubricated on itself in ...
Microcracks inevitably appear on the SiC wafer surface during conventional thinning. It is generally...
Silicon carbide materials are excellent candidates for high-performance applications due to their ou...