A study of chemical products formed on sapphire (0001) during chemical-mechanical polishing is presented. The results demonstrated that the formation and removal of chemical products both proceeded from the hexagonal close-packed sapphire Al-O layers described as atomic terraces, and the material removal rule of sapphire (0001) during chemical-mechanical polishing is the regular removal of chemical products formed from the atomic terraces, which were successfully characterized by AFM with super-sharp scanning probes. Besides, we also found that the surface with screw dislocations could not be polished completely by CMP due to the crystal distortion energy, and a hard polishing pad could remove scratches more effectively than a soft one.</p
Single-crystal sapphire (α-Al2O3) is an important material and widely used in many advanced fields. ...
Abstract The chemical mechanical polishing (CMP) process has become a widely accepted global planari...
This paper tries to investigate a novel polishing technology with high efficiency and nice surface q...
A study of chemical products formed on sapphire (0001) during chemical-mechanical polishing is prese...
A study of chemical products formed on sapphire (0001) during chemical–mechanical polishing is prese...
The material removal mechanism of sapphire wafer during chemical mechanical polishing has been studi...
The material removal mechanism of sapphire wafer during chemical mechanical polishing has been studi...
Chemical-mechanical polishing (CMP) has drawn significant attention as one of the most advanced tech...
The influence of mechanical polishing, chemo-mechanical polishing (CMP), as well as CMP and subseque...
Sapphire chemical mechanical polishing (CMP) performances using silica particles with different size...
In this paper, a novel non-noble metal catalyst (Fe-N x /C) is used to improve the removal mass of ...
In this paper, a novel non-noble metal catalyst (Fe-Nx/C) is used to improve the removal mass of sap...
Surface quality of LED sapphire substrate influences epitaxy quality greatly, and further influences...
In this paper, an innovative study is presented to characterize the chemical-mechanical planarizatio...
Towards sapphire and SiC wafer, clear and regular atomic step morphology could be observed all-over ...
Single-crystal sapphire (α-Al2O3) is an important material and widely used in many advanced fields. ...
Abstract The chemical mechanical polishing (CMP) process has become a widely accepted global planari...
This paper tries to investigate a novel polishing technology with high efficiency and nice surface q...
A study of chemical products formed on sapphire (0001) during chemical-mechanical polishing is prese...
A study of chemical products formed on sapphire (0001) during chemical–mechanical polishing is prese...
The material removal mechanism of sapphire wafer during chemical mechanical polishing has been studi...
The material removal mechanism of sapphire wafer during chemical mechanical polishing has been studi...
Chemical-mechanical polishing (CMP) has drawn significant attention as one of the most advanced tech...
The influence of mechanical polishing, chemo-mechanical polishing (CMP), as well as CMP and subseque...
Sapphire chemical mechanical polishing (CMP) performances using silica particles with different size...
In this paper, a novel non-noble metal catalyst (Fe-N x /C) is used to improve the removal mass of ...
In this paper, a novel non-noble metal catalyst (Fe-Nx/C) is used to improve the removal mass of sap...
Surface quality of LED sapphire substrate influences epitaxy quality greatly, and further influences...
In this paper, an innovative study is presented to characterize the chemical-mechanical planarizatio...
Towards sapphire and SiC wafer, clear and regular atomic step morphology could be observed all-over ...
Single-crystal sapphire (α-Al2O3) is an important material and widely used in many advanced fields. ...
Abstract The chemical mechanical polishing (CMP) process has become a widely accepted global planari...
This paper tries to investigate a novel polishing technology with high efficiency and nice surface q...