The origin and the formation mechanism of a surface morphological defect in 4H-SiC epilayers are reported. The defect appears on the surface of an epilayer as an inclined line-like feature at an angle of +/- 80 degrees to the step-flow direction [ 11 2 over bar 0 ] . The defect is confirmed to originate from a threading screw dislocation intersecting the surface and its orientation is controlled by the sign of the Burgers vector of the dislocation. The defect forms through the interaction of local spiral growth associated with threading screw dislocations and step-flow growth related to the substrate offcut. The defect mainly appears in the epilayers grown through chloride-based chemistry, where in situ surface preparation of the substrate ...
A novel process for low-temperature (LT) epitaxial growth of silicon carbide (SiC) by replacing the ...
By carefully controlling the surface chemistry of the chemical vapor deposition process for silicon ...
A study of the in-situ surface preparation has been performed for both Si- and C-face 4H-SiC nominal...
The origin and the formation mechanism of a surface morphological defect in 4H-SiC epilayers are rep...
The morphological defects and uniformity of 4H-SiC epilayers grown by hot wall CVD at 1500 degrees C...
Dislocation behavior during homo-epitaxy of 4H-SiC on offcut substrates by Chemical Vapor Deposition...
Silicon carbide (SiC) semiconductor technology has been advancing rapidly, but there are numerous cr...
In this work, 4H-SiC epilayers are performed on 4° off-axis substrates under low pressure condition ...
Dislocation conversion in 4H-SiC single crystals grown by metastable solvent epitaxy (MSE) was inves...
Evolution of threading screw dislocation (TSD) conversion during the solution growth of 4H-SiC on a ...
Abstract. In this study of 4H-SiC and 6H-SiC epitaxial films we found that film morphology was stron...
Surface defects with intrinsic origins in an epitaxial layer on 4H-SiC wafers were observed by scann...
Correlation between dislocation types in epitaxial 4H-SiC and etch pit types on the 4H-SiC wafer sur...
Surface defects on 4H-SiC wafers with an epitaxial layer grown by chemical vapor deposition (CVD) we...
Basal Plane Dislocations (BPD) in SiC are thought to cause degradation of bipolar devices as they ca...
A novel process for low-temperature (LT) epitaxial growth of silicon carbide (SiC) by replacing the ...
By carefully controlling the surface chemistry of the chemical vapor deposition process for silicon ...
A study of the in-situ surface preparation has been performed for both Si- and C-face 4H-SiC nominal...
The origin and the formation mechanism of a surface morphological defect in 4H-SiC epilayers are rep...
The morphological defects and uniformity of 4H-SiC epilayers grown by hot wall CVD at 1500 degrees C...
Dislocation behavior during homo-epitaxy of 4H-SiC on offcut substrates by Chemical Vapor Deposition...
Silicon carbide (SiC) semiconductor technology has been advancing rapidly, but there are numerous cr...
In this work, 4H-SiC epilayers are performed on 4° off-axis substrates under low pressure condition ...
Dislocation conversion in 4H-SiC single crystals grown by metastable solvent epitaxy (MSE) was inves...
Evolution of threading screw dislocation (TSD) conversion during the solution growth of 4H-SiC on a ...
Abstract. In this study of 4H-SiC and 6H-SiC epitaxial films we found that film morphology was stron...
Surface defects with intrinsic origins in an epitaxial layer on 4H-SiC wafers were observed by scann...
Correlation between dislocation types in epitaxial 4H-SiC and etch pit types on the 4H-SiC wafer sur...
Surface defects on 4H-SiC wafers with an epitaxial layer grown by chemical vapor deposition (CVD) we...
Basal Plane Dislocations (BPD) in SiC are thought to cause degradation of bipolar devices as they ca...
A novel process for low-temperature (LT) epitaxial growth of silicon carbide (SiC) by replacing the ...
By carefully controlling the surface chemistry of the chemical vapor deposition process for silicon ...
A study of the in-situ surface preparation has been performed for both Si- and C-face 4H-SiC nominal...