In this research, densification and shape distortion of the Al-Cu-Mg (Al2024) pre-alloyed powder compact in the supersolidus liquid phase sintering process (SLPS) were investigated. The effect of Sn on the sintering process was also studied. The powders were compacted at pressures ranging from 100 to 500 MPa in a cylindrical die. The sintering process was performed in a dry N2 atmosphere at various temperatures (580-620 ºC) for 30 min at a heating rate of 10 ºCmin-1. Results showed that the onset of densification process was observed at 600ºC and onset of distortion was occurred at 610ºC. Addition of 0.1 wt. %Sn to the alloy has increased the distortion of the samples produced from Al-Cu-Mg pre-alloyed powder, but their densification has be...
An understanding of the expansion and shrinkage behaviour during the liquid phase sintering of admix...
The liquid phase sintering characteristics of Al-Cu-Zn alloy were investigated with respect to vario...
During sintering, powder compacts gain strength through low-temperature interparticle bonding, usual...
Prealloyed powders usually melt over a range of temperatures. This feature is useful in performing s...
The current, commercially available, press and sinter Al-Mg-Si-Cu alloys are based on wrought or cas...
The paper is focused on the role of the pressing pressure on the densification behaviour of PM alumi...
Alloys of Al-3.8Cu-1Mg, Al-3.8Cu-1Mg-0.7Si, Al-3.8Cu-1Mg-0.1Sn and Al-3.8Cu-1Mg-0.7Si-0.1Sn were mad...
It is demonstrated that slow cooling to 200 degrees C from a high sintering temperature (620 degrees...
The sintering characteristics and the tensile properties of the 7000 series Al-Zn-Mg-Cu alloys, fabr...
Purpose: Binder jetting is a promising route to produce complex copper components for electronic/the...
Purpose: Binder jetting is a promising route to produce complex copper components for electronic/the...
Aluminium-based powder metallurgy (PM) alloys have a number of advantages over cast and wrought alum...
Purpose: Binder jetting is a promising route to produce complex copper components for electronic/the...
141-149In the present investigation, the sintering of T15 HSS (particle size range of 63-106 μm) wi...
Purpose: Binder jetting is a promising route to produce complex copper components for electronic/the...
An understanding of the expansion and shrinkage behaviour during the liquid phase sintering of admix...
The liquid phase sintering characteristics of Al-Cu-Zn alloy were investigated with respect to vario...
During sintering, powder compacts gain strength through low-temperature interparticle bonding, usual...
Prealloyed powders usually melt over a range of temperatures. This feature is useful in performing s...
The current, commercially available, press and sinter Al-Mg-Si-Cu alloys are based on wrought or cas...
The paper is focused on the role of the pressing pressure on the densification behaviour of PM alumi...
Alloys of Al-3.8Cu-1Mg, Al-3.8Cu-1Mg-0.7Si, Al-3.8Cu-1Mg-0.1Sn and Al-3.8Cu-1Mg-0.7Si-0.1Sn were mad...
It is demonstrated that slow cooling to 200 degrees C from a high sintering temperature (620 degrees...
The sintering characteristics and the tensile properties of the 7000 series Al-Zn-Mg-Cu alloys, fabr...
Purpose: Binder jetting is a promising route to produce complex copper components for electronic/the...
Purpose: Binder jetting is a promising route to produce complex copper components for electronic/the...
Aluminium-based powder metallurgy (PM) alloys have a number of advantages over cast and wrought alum...
Purpose: Binder jetting is a promising route to produce complex copper components for electronic/the...
141-149In the present investigation, the sintering of T15 HSS (particle size range of 63-106 μm) wi...
Purpose: Binder jetting is a promising route to produce complex copper components for electronic/the...
An understanding of the expansion and shrinkage behaviour during the liquid phase sintering of admix...
The liquid phase sintering characteristics of Al-Cu-Zn alloy were investigated with respect to vario...
During sintering, powder compacts gain strength through low-temperature interparticle bonding, usual...