This thesis is concerned with the interconnection problem of custom integrated circuits. It may be broadly defined as the transformation of circuit description represented by the notion of modules together with the circuit connectivity requirements, into wiring patterns which implement the required connectivities. Conventional approaches to its solution are presented. Issues such as partition to placement and routing and various layout optimization tradeoffs are discussed. A detail hierarchical routing model with timing considerations that extends naturally to multiple conducting layer environment is presented. Several of the implications of this extension are also discussed. The rest of this thesis deals with an experiment with t...
In recent years artificial intelligence techniques have been extensively applied to. real world pro...
172 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1993.This thesis deals with four p...
In recent times, even small improvements in performance and power are seen as huge wins in digital i...
This thesis is concerned with the interconnection problem of custom integrated circuits. It may be ...
105 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1987.This thesis studies two hiera...
Abstract | Deep sub-micron e ects, along with increasing interconnect densities, have increased the ...
The advent of the nanotechnology has introduced new challenges and non-conventional problems to high...
A channel is a rectangular area of a VLSI (Very Large Scale Integrated) chip which is used to make e...
This book covers layout design and layout migration methodologies for optimizing multi-net wire stru...
177 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1986.In this thesis, we study an a...
In this thesis, we solve several important routing problems in the physical design of VLSI circuits....
In this thesis algorithms for solving performance-driven chip floorplanning and global routing probl...
Using on-chip interconnection networks in place of ad-hoc global wiring structures the top level wir...
AbstractIn this paper the problem of interconnecting circuit modules in microprocessor and digital s...
In this paper, we study the interconnect layout optimization problem under a higher order resistance...
In recent years artificial intelligence techniques have been extensively applied to. real world pro...
172 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1993.This thesis deals with four p...
In recent times, even small improvements in performance and power are seen as huge wins in digital i...
This thesis is concerned with the interconnection problem of custom integrated circuits. It may be ...
105 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1987.This thesis studies two hiera...
Abstract | Deep sub-micron e ects, along with increasing interconnect densities, have increased the ...
The advent of the nanotechnology has introduced new challenges and non-conventional problems to high...
A channel is a rectangular area of a VLSI (Very Large Scale Integrated) chip which is used to make e...
This book covers layout design and layout migration methodologies for optimizing multi-net wire stru...
177 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1986.In this thesis, we study an a...
In this thesis, we solve several important routing problems in the physical design of VLSI circuits....
In this thesis algorithms for solving performance-driven chip floorplanning and global routing probl...
Using on-chip interconnection networks in place of ad-hoc global wiring structures the top level wir...
AbstractIn this paper the problem of interconnecting circuit modules in microprocessor and digital s...
In this paper, we study the interconnect layout optimization problem under a higher order resistance...
In recent years artificial intelligence techniques have been extensively applied to. real world pro...
172 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1993.This thesis deals with four p...
In recent times, even small improvements in performance and power are seen as huge wins in digital i...