DOIAbstract
10.1117/12.638521Proceedings of SPIE - The International Society for Optical Engineering6037-PSIS
10.1117/12.638521Proceedings of SPIE - The International Society for Optical Engineering6037-PSIS
Inductively coupled plasma reactive ion etching (ICP RIE) has been successfully used for deep (>3...
The subject of this study is a new method of glass etching and its application in microfluidics. Com...
Deep reactive ion etching (DRIE) of borosilicate glass and profile control of an etched groove are r...
10.1109/SMICND.2005.1558704Proceedings of the International Semiconductor Conference, CAS135-4
10.1016/j.sna.2006.06.044Sensors and Actuators, A: Physical1332 SPEC. ISS.395-400SAAP
This paper is a review of wet and dry etching of one of the most common types of glass: Pyrex. The p...
10.1016/j.surfcoat.2004.10.094Surface and Coatings Technology1981-3 SPEC. ISS.314-31
在玻璃上刻蚀凹槽作为腔体,是半导体制造工艺中一个新方法。本文讨论了玻璃湿法腐蚀的工艺方法,通过清洗、涂胶、光刻、腐蚀等工艺的反复实验,分析了涂胶厚度与甩胶速率的关系,腐蚀深度随腐蚀时间的变化情况,并总...
This note presents a simple, low-cost technology to fabricate very deep isotropically etched feature...
Deep reactive ion etching (DRIE) processes have been developed for fabricating fluidic devices in gl...
This paper presents processes for glass micromachining, including sandblast, wet etching, reactive i...
A new masking technology useful for wet etching of glass, to a depth of more than 300µm, is reported...
This report describes a study designed to explore the different properties of two different chalcoge...
10.1007/s00339-008-4674-0Applied Physics A: Materials Science and Processing931159-163APAM
A new masking technology for wet etching of glass, to a depth of more than 300µm, is reported. Vario...
Inductively coupled plasma reactive ion etching (ICP RIE) has been successfully used for deep (>3...
The subject of this study is a new method of glass etching and its application in microfluidics. Com...
Deep reactive ion etching (DRIE) of borosilicate glass and profile control of an etched groove are r...
10.1109/SMICND.2005.1558704Proceedings of the International Semiconductor Conference, CAS135-4
10.1016/j.sna.2006.06.044Sensors and Actuators, A: Physical1332 SPEC. ISS.395-400SAAP
This paper is a review of wet and dry etching of one of the most common types of glass: Pyrex. The p...
10.1016/j.surfcoat.2004.10.094Surface and Coatings Technology1981-3 SPEC. ISS.314-31
在玻璃上刻蚀凹槽作为腔体,是半导体制造工艺中一个新方法。本文讨论了玻璃湿法腐蚀的工艺方法,通过清洗、涂胶、光刻、腐蚀等工艺的反复实验,分析了涂胶厚度与甩胶速率的关系,腐蚀深度随腐蚀时间的变化情况,并总...
This note presents a simple, low-cost technology to fabricate very deep isotropically etched feature...
Deep reactive ion etching (DRIE) processes have been developed for fabricating fluidic devices in gl...
This paper presents processes for glass micromachining, including sandblast, wet etching, reactive i...
A new masking technology useful for wet etching of glass, to a depth of more than 300µm, is reported...
This report describes a study designed to explore the different properties of two different chalcoge...
10.1007/s00339-008-4674-0Applied Physics A: Materials Science and Processing931159-163APAM
A new masking technology for wet etching of glass, to a depth of more than 300µm, is reported. Vario...
Inductively coupled plasma reactive ion etching (ICP RIE) has been successfully used for deep (>3...
The subject of this study is a new method of glass etching and its application in microfluidics. Com...
Deep reactive ion etching (DRIE) of borosilicate glass and profile control of an etched groove are r...
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