The role of simulation in failure prediction and design optimization in electronics packaging

Tay, A.A.O.

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Publication date

January 2006

DOI

10.1109/ESIME.2006.1644060

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Abstract

10.1109/ESIME.2006.16440607th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 20062006

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The role of simulation in failure prediction and design optimization in electronics packaging

Abstract

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The role of simulation in failure prediction and design optimization in electronics packaging

Abstract

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