10.1016/j.jmatprotec.2007.06.077Journal of Materials Processing Technology1981-3281-290JMPT
Brittle-hardmaterials like ceramics and cermets are used in many challenging applicationsbecause the...
Silicon wafers are the most widely used substrates for fabricating integrated circuits (ICs). The qu...
Silicon wafers are the most widely used substrates for fabricating integrated circuits (ICs). The qu...
Silicon wafers are the most widely used substrates for fabricating integrated circuits. There have b...
Silicon wafers are the most widely used substrates for fabricating integrated circuits. There have b...
It is difficult for the lapping-based manufacturing method currently used to manufacture the majorit...
It is difficult for the lapping-based manufacturing method currently used to manufacture the majorit...
The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality sil...
[[abstract]]In order to machine the 300mm-400mm silicon wafer to the specifiedsurface roughness and ...
The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality sil...
The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality sil...
10.1016/j.jmatprotec.2007.04.034Journal of Materials Processing Technology192-193287-291JMPT
Grinding is an important process for manufacturing of silicon wafers. The demand for silicon wafers ...
Grinding is an important process for manufacturing of silicon wafers. The demand for silicon wafers ...
Microchip device production depends heavily on high-quality silicon wafers. Current developments in ...
Brittle-hardmaterials like ceramics and cermets are used in many challenging applicationsbecause the...
Silicon wafers are the most widely used substrates for fabricating integrated circuits (ICs). The qu...
Silicon wafers are the most widely used substrates for fabricating integrated circuits (ICs). The qu...
Silicon wafers are the most widely used substrates for fabricating integrated circuits. There have b...
Silicon wafers are the most widely used substrates for fabricating integrated circuits. There have b...
It is difficult for the lapping-based manufacturing method currently used to manufacture the majorit...
It is difficult for the lapping-based manufacturing method currently used to manufacture the majorit...
The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality sil...
[[abstract]]In order to machine the 300mm-400mm silicon wafer to the specifiedsurface roughness and ...
The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality sil...
The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality sil...
10.1016/j.jmatprotec.2007.04.034Journal of Materials Processing Technology192-193287-291JMPT
Grinding is an important process for manufacturing of silicon wafers. The demand for silicon wafers ...
Grinding is an important process for manufacturing of silicon wafers. The demand for silicon wafers ...
Microchip device production depends heavily on high-quality silicon wafers. Current developments in ...
Brittle-hardmaterials like ceramics and cermets are used in many challenging applicationsbecause the...
Silicon wafers are the most widely used substrates for fabricating integrated circuits (ICs). The qu...
Silicon wafers are the most widely used substrates for fabricating integrated circuits (ICs). The qu...
DOI
Add to ORKG