Height inspection of wafer bumps without explicit 3D reconstruction.

by Dong, Mei.Thesis (M.Phil.)--Chinese University of Hong Kong, 2007.Includes bibliographical references (leaves 83-90).Abstracts in English and Chinese.INTRODUCTION --- p.1Chapter 1.1 --- Bump Height Inspection --- p.1Chapter 1.2 --- Our Height Inspection System --- p.2Chapter 1.3 --- Thesis Outline --- p.3BACKGROUND --- p.5Chapter 2.1 --- Wafer Bumps --- p.5Chapter 2.2 --- Common Defects of Wafer Bumps --- p.7Chapter 2.3 --- Traditional Methods for Bump Inspection --- p.11BIPLANAR DISPARITY METHOD --- p.22Chapter 3.1 --- Problem Nature --- p.22Chapter 3.2 --- System Overview --- p.25Chapter 3.3 --- Biplanar Disparity Matrix D --- p.30Chapter 3.4 --- Planar Homography --- p.36Chapter 3.4.1 --- Planar Homography --- p.36Chapter 3.4.2 --- Homography Estimation --- p.39Chapter 3.5 --- Harris Corner Detector --- p.45Chapter 3.6 --- Experiments --- p.47Chapter 3.6.1 --- Synthetic Experiments --- p.47Chapter 3.6.2 --- Real image experiment --- p.52Chapter 3.7 --- Conclusion and problems --- p.61PARAPLANAR DISPARITY METHOD --- p.62Chapter 4.1 --- The Parallel Constraint --- p.63Chapter 4.2 --- Homography estimation --- p.66Chapter 4.3. --- Experiment: --- p.69Chapter 4.3.1 --- Synthetic Experiment: --- p.69Chapter 4.3.2 --- Real Image Experiment: --- p.74CONCLUSION AND FUTURE WORK --- p.80Chapter 5.1 --- Summary of the contributions --- p.80Chapter 5.2 --- Future Work --- p.81Publication related to this work: --- p.83BIBLIOGRAPHY --- p.8