An intense pulsed light (IPL) from a xenon flash lamp was used to sinter copper nanoink printed on low-temperature polymer substrates at room temperature in ambient condition. The IPL can sinter the copper nanoink without damaging the polymer substrates in extremely short time (2 ms). The microstructure of the sintered copper film was investigated using X-ray powder diffraction (XRD), optical microscopy, scanning electron microscopy (SEM), X-ray micro tomography, and atomic force microscopy (AFM). The sintered copper film has a grainy structure with neck-like junctions. The resulting resistivity was 5 μΩ cm of electrical resistivity which is only 3 times as high as that of bulk copper. The IPL sintering technique allows copper nanoparticles...
In this work, the microstructures of inkjet-printed nanosilver films sintered by intense pulsed ligh...
We developed an ultra-high speed photonic sintering method involving flash white light (FWL) combine...
Recently, printing technologies have been adapted for the manufacturing of flexible electronic devic...
In this contribution we discuss the sintering of an inkjet-printed copper nanoparticle ink based on ...
Pulse management of white light to maximize the sintering efficiency of a rapid (msec) and substrate...
A two-step flash light sintering process was devised to reduce the warping of polymer substrates dur...
In this study, an ink formulation was developed to prepare conductive copper thin films with compact...
In this work, a flash-light sintering process for Cu nanoinks was studied. In order to precisely mon...
Most commercial copper nanoparticles are covered with an oxide shell and cannot be sintered into con...
Most commercial copper nanoparticles are covered with an oxide shell and cannot be sintered into con...
In this paper, wavelength of the white light was controlled by Cut-off filters. Also, the flash whit...
Abstract Additively printed circuits provide advantages in reduced waste, rapid prototyping, and ver...
Inkjet printing of various nanoparticle inks, made from silver or copper nanoparticles, and its tran...
We demonstrate intense pulsed light (IPL) sintering of inkjet-printed CuO layers on a primer-coated ...
In this study, the size effect of copper particles on the flash light sintering of copper (Cu) ink w...
In this work, the microstructures of inkjet-printed nanosilver films sintered by intense pulsed ligh...
We developed an ultra-high speed photonic sintering method involving flash white light (FWL) combine...
Recently, printing technologies have been adapted for the manufacturing of flexible electronic devic...
In this contribution we discuss the sintering of an inkjet-printed copper nanoparticle ink based on ...
Pulse management of white light to maximize the sintering efficiency of a rapid (msec) and substrate...
A two-step flash light sintering process was devised to reduce the warping of polymer substrates dur...
In this study, an ink formulation was developed to prepare conductive copper thin films with compact...
In this work, a flash-light sintering process for Cu nanoinks was studied. In order to precisely mon...
Most commercial copper nanoparticles are covered with an oxide shell and cannot be sintered into con...
Most commercial copper nanoparticles are covered with an oxide shell and cannot be sintered into con...
In this paper, wavelength of the white light was controlled by Cut-off filters. Also, the flash whit...
Abstract Additively printed circuits provide advantages in reduced waste, rapid prototyping, and ver...
Inkjet printing of various nanoparticle inks, made from silver or copper nanoparticles, and its tran...
We demonstrate intense pulsed light (IPL) sintering of inkjet-printed CuO layers on a primer-coated ...
In this study, the size effect of copper particles on the flash light sintering of copper (Cu) ink w...
In this work, the microstructures of inkjet-printed nanosilver films sintered by intense pulsed ligh...
We developed an ultra-high speed photonic sintering method involving flash white light (FWL) combine...
Recently, printing technologies have been adapted for the manufacturing of flexible electronic devic...