Facilitated by the increasing importance and demand of thin-film materials, plasma-enhanced atomic layer deposition (PEALD) has gained tremendous industrial interest as it offers a way to efficiently deposit thin-films with ultra-high conformity. Despite the variety of PEALD processes, there lacks a fundamental and general methodology to understand, characterize and control a realistic PEALD process system. To fully understand the PEALD process, a series of studies have been carried out in our previous work. First, a kinetic Monte-Carlo (kMC)-based microscopic model that describes the surface dynamics was implemented and a multiscale CFD model was developed to characterize the PEALD process. Additionally, a corresponding multiscale data-dri...
Abstract: Tremendous interest has been drawn towards the atomic layer deposition (ALD) as an ultrath...
The fabrication of microelectronics relies on thin film technologies. As the demand for improved per...
Abstract—As microelectronics device feature sizes continue to shrink and wafers continue to increase...
Facilitated by the increasing importance and demand of semiconductors for the smartphoneand even the...
Plasma-enhanced atomic layer deposition (PEALD) has demonstrated its superiority at coatingultra-con...
Atomic layer deposition (ALD) and plasma enhanced atomic layer deposition (PEALD) are the most widel...
Atomic layer deposition (ALD) is a thin-film manufacturing process in which the growth surface is ex...
Functionality and Optimization of a Laminar Flow Reactor Utilizing Plasma Enhanced Atomic Layer Depo...
Processing at the atomic scale is becoming increasingly critical for state-of-the-art electronic dev...
Today, plasma-enhanced chemical vapor deposition (PECVD) remains the dominant processing method for ...
Plasma-assisted atomic layer deposition (ALD) is an energy-enhanced method for the synthesis of ultr...
Plasma-assisted atomic layer deposition (ALD) is an energy-enhanced method for the synthesis of ultr...
Hafnium oxide films deposited on silicon wafers from TEMAH and O2 plasma showed satn. at growth rate...
Atomic Layer Deposition (ALD) is a vapor-phase deposition technique in which ultrathin films are syn...
An inherent challenge to achieving improvements in thin film deposition processes is that requiremen...
Abstract: Tremendous interest has been drawn towards the atomic layer deposition (ALD) as an ultrath...
The fabrication of microelectronics relies on thin film technologies. As the demand for improved per...
Abstract—As microelectronics device feature sizes continue to shrink and wafers continue to increase...
Facilitated by the increasing importance and demand of semiconductors for the smartphoneand even the...
Plasma-enhanced atomic layer deposition (PEALD) has demonstrated its superiority at coatingultra-con...
Atomic layer deposition (ALD) and plasma enhanced atomic layer deposition (PEALD) are the most widel...
Atomic layer deposition (ALD) is a thin-film manufacturing process in which the growth surface is ex...
Functionality and Optimization of a Laminar Flow Reactor Utilizing Plasma Enhanced Atomic Layer Depo...
Processing at the atomic scale is becoming increasingly critical for state-of-the-art electronic dev...
Today, plasma-enhanced chemical vapor deposition (PECVD) remains the dominant processing method for ...
Plasma-assisted atomic layer deposition (ALD) is an energy-enhanced method for the synthesis of ultr...
Plasma-assisted atomic layer deposition (ALD) is an energy-enhanced method for the synthesis of ultr...
Hafnium oxide films deposited on silicon wafers from TEMAH and O2 plasma showed satn. at growth rate...
Atomic Layer Deposition (ALD) is a vapor-phase deposition technique in which ultrathin films are syn...
An inherent challenge to achieving improvements in thin film deposition processes is that requiremen...
Abstract: Tremendous interest has been drawn towards the atomic layer deposition (ALD) as an ultrath...
The fabrication of microelectronics relies on thin film technologies. As the demand for improved per...
Abstract—As microelectronics device feature sizes continue to shrink and wafers continue to increase...