Tantalum (Ta) diffusion barriers used in Nb3Sn superconductors deform nonuniformly during wire drawing. A strategy sometimes used to mitigate this problem is to place a sacrificial layer of niobium (Nb) next to the Ta to act as a mechanical transition zone between the softer Cu-Nb composite and the harder Ta. This approach can promote more uniform co-deformation of the Ta layer enabling thinner Ta layers and a reduced chance of layer rupture, and has the added benefit of providing additional Nb for conversion to Nb3Sn. A thinner Ta layer translates to less Ta volume and less cost. In the current work the authors find that a layer of Nb adjacent to a Ta layer embedded in Cu significantly increases the composite wire strain to fracture, and a...
The alloying of Ti with Cu(Sn) and Nb significantly increases the grain boundary diffusion-controlle...
a b s t r a c t One of the most important processes in Cu metallization for highly integrated circui...
This study explored the possibility of employing a bi-layer barrier of electroless-plated Ni(P)/thin...
Tantalum (Ta) diffusion barriers used in Nb3Sn superconductors deform nonuniformly during wire drawi...
Poor deformation behavior of tantalum (Ta) sheet used for tin diffusion barriers in Nb3Sn composite ...
Poor co-deformation behavior of commercial polycrystalline tantalum (Ta) sheet used for tin diffusio...
A common problem with manufacture of composite Nb3Sn superconductor wire which contains a tantalum d...
The effect of tantalum and titanium additions on the composition, the superconducting properties, an...
AbstractThe effect of tantalum and titanium additions on the composition, the superconducting proper...
High critical current density ( Jc) Nb$_{3}$Sn A15 multifilamentary wires require a large volume fra...
Strain limit for critical current degradation in various technical rapid-heating, quenching, and tra...
A strategy to obtain higher critical current density (Jc) in Nb 3Sn conductors is to increase the Nb...
The push to drive superconductor strand technology to reach higher critical current density (Jc) val...
The production of superconducting Nb3Sn multifilamentary wires with optimized critical currents requ...
We have analyzed the influence of Ta on the superconducting properties of Ti doped bronze processed ...
The alloying of Ti with Cu(Sn) and Nb significantly increases the grain boundary diffusion-controlle...
a b s t r a c t One of the most important processes in Cu metallization for highly integrated circui...
This study explored the possibility of employing a bi-layer barrier of electroless-plated Ni(P)/thin...
Tantalum (Ta) diffusion barriers used in Nb3Sn superconductors deform nonuniformly during wire drawi...
Poor deformation behavior of tantalum (Ta) sheet used for tin diffusion barriers in Nb3Sn composite ...
Poor co-deformation behavior of commercial polycrystalline tantalum (Ta) sheet used for tin diffusio...
A common problem with manufacture of composite Nb3Sn superconductor wire which contains a tantalum d...
The effect of tantalum and titanium additions on the composition, the superconducting properties, an...
AbstractThe effect of tantalum and titanium additions on the composition, the superconducting proper...
High critical current density ( Jc) Nb$_{3}$Sn A15 multifilamentary wires require a large volume fra...
Strain limit for critical current degradation in various technical rapid-heating, quenching, and tra...
A strategy to obtain higher critical current density (Jc) in Nb 3Sn conductors is to increase the Nb...
The push to drive superconductor strand technology to reach higher critical current density (Jc) val...
The production of superconducting Nb3Sn multifilamentary wires with optimized critical currents requ...
We have analyzed the influence of Ta on the superconducting properties of Ti doped bronze processed ...
The alloying of Ti with Cu(Sn) and Nb significantly increases the grain boundary diffusion-controlle...
a b s t r a c t One of the most important processes in Cu metallization for highly integrated circui...
This study explored the possibility of employing a bi-layer barrier of electroless-plated Ni(P)/thin...