With the increase in the density of interconnects and the complexity of high-speed packages, signal integrity becomes an important aspect in the design of modern devices. Circuit designers are constantly in need of robust circuit simulation methods that are able to capture the complicated electromagnetic behaviors of complex circuits, and do it in a fraction of the time taken by conventional circuit simulators. As a result, there is a constant need for and push toward faster and more accurate circuit simulation techniques. The latency insertion method (LIM) has recently emerged as an efficient approach for performing fast simulations of very large circuits. By exploiting latencies in the circuit, LIM is able to solve the voltages and the...
In this article, we propose several improvements that could be done to SPICE simulator. The first is...
In this article, we propose several improvements that could be done to SPICE simulator. The first is...
As semiconductor devices become more densely integrated on a single chip, complexity of packaging ha...
With the increase in the density of interconnects and the complexity of high-speed packages, signal ...
With the remarkable success in the electronics industry, the designers working in the engineering co...
The focus of this research is to explore the applications of the finite difference formulation based...
This thesis presents a modified Latency Insertion Method (LIM) that can be applied for signal and po...
This work presents methodologies to facilitate the efficient cosimulation of electromagnetic/circuit...
In this thesis, a tool is presented for extracting frequency domain scattering parameters that utili...
The design and verification of a electronic circuit requires much expertise and intelligent tools an...
Guided by electromagnetics-based first principles, we develop a circuit simulator that allows for th...
We have developed a highly parallel and accelerated circuit simulator which produces precise results...
171 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1983.The simulation of VLSI circui...
The most efficient simulation solvers use composite procedures that adaptively rearrange computatio...
As a most critical form of pre-silicon verification, transistor-level circuit simulation is an indis...
In this article, we propose several improvements that could be done to SPICE simulator. The first is...
In this article, we propose several improvements that could be done to SPICE simulator. The first is...
As semiconductor devices become more densely integrated on a single chip, complexity of packaging ha...
With the increase in the density of interconnects and the complexity of high-speed packages, signal ...
With the remarkable success in the electronics industry, the designers working in the engineering co...
The focus of this research is to explore the applications of the finite difference formulation based...
This thesis presents a modified Latency Insertion Method (LIM) that can be applied for signal and po...
This work presents methodologies to facilitate the efficient cosimulation of electromagnetic/circuit...
In this thesis, a tool is presented for extracting frequency domain scattering parameters that utili...
The design and verification of a electronic circuit requires much expertise and intelligent tools an...
Guided by electromagnetics-based first principles, we develop a circuit simulator that allows for th...
We have developed a highly parallel and accelerated circuit simulator which produces precise results...
171 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1983.The simulation of VLSI circui...
The most efficient simulation solvers use composite procedures that adaptively rearrange computatio...
As a most critical form of pre-silicon verification, transistor-level circuit simulation is an indis...
In this article, we propose several improvements that could be done to SPICE simulator. The first is...
In this article, we propose several improvements that could be done to SPICE simulator. The first is...
As semiconductor devices become more densely integrated on a single chip, complexity of packaging ha...