The focus of this research is to explore the applications of the finite difference formulation based on the latency insertion method (LIM) to the analysis of circuit interconnects. Special attention is devoted to addressing the issues that arise in very large networks such as on-chip signal and power distribution networks. We demonstrate that the LIM has the power and flexibility to handle various types of analysis required at different stages of circuit design. The LIM is particularly suitable for simulations of very large scale linear networks and can significantly outperform conventional circuit solvers (such as SPICE)
The ongoing progress in transistor miniaturization and a continuous frequency increase are the main ...
With increasing design complexity, huge size of extracted interconnect data is pushing the capacity ...
With shrinking feature size and growing integration density in the Deep Sub- Micron (DSM) technologi...
In this thesis, a tool is presented for extracting frequency domain scattering parameters that utili...
With the increase in the density of interconnects and the complexity of high-speed packages, signal ...
With the increase in the density of interconnects and the complexity of high-speed packages, signal ...
This thesis presents a modified Latency Insertion Method (LIM) that can be applied for signal and po...
With the remarkable success in the electronics industry, the designers working in the engineering co...
As semiconductor devices become more densely integrated on a single chip, complexity of packaging ha...
With the steadily growing number of transistors on a chip, and constantly tightening voltage budgets...
Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with ...
Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with ...
75 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2006.Another objective of this diss...
Abstract—This paper presents a modeling method for power distribution networks (PDNs) consisting of ...
This thesis work presents a methodology for exploiting time domain latency in EMTP-type programs fo...
The ongoing progress in transistor miniaturization and a continuous frequency increase are the main ...
With increasing design complexity, huge size of extracted interconnect data is pushing the capacity ...
With shrinking feature size and growing integration density in the Deep Sub- Micron (DSM) technologi...
In this thesis, a tool is presented for extracting frequency domain scattering parameters that utili...
With the increase in the density of interconnects and the complexity of high-speed packages, signal ...
With the increase in the density of interconnects and the complexity of high-speed packages, signal ...
This thesis presents a modified Latency Insertion Method (LIM) that can be applied for signal and po...
With the remarkable success in the electronics industry, the designers working in the engineering co...
As semiconductor devices become more densely integrated on a single chip, complexity of packaging ha...
With the steadily growing number of transistors on a chip, and constantly tightening voltage budgets...
Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with ...
Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with ...
75 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2006.Another objective of this diss...
Abstract—This paper presents a modeling method for power distribution networks (PDNs) consisting of ...
This thesis work presents a methodology for exploiting time domain latency in EMTP-type programs fo...
The ongoing progress in transistor miniaturization and a continuous frequency increase are the main ...
With increasing design complexity, huge size of extracted interconnect data is pushing the capacity ...
With shrinking feature size and growing integration density in the Deep Sub- Micron (DSM) technologi...