Add to ORKGThe demand for lightweight and high functionality devices have been a driving force in the development of smaller, lighter and compact electronics circuit. While printed circuit board (PCB) can provides interconnection and allow components to be assembled on, solder paste is needed to connect the two surfaces together by going through reflow during surface mount technology (SMT) process. The solder joints provide not only electrical integrity, but also mechanical support to hold the components in place. Due to environmental concern, lead-containing solder where the Sn content is 5-70%, has been replaced with lead-free solder where the Sn content is ~95%. Lead-free solder has higher melting temperature and thus higher processing...
*Corresponding author Abstract: In the next generation nanoelectronics and SiC based electronic pack...
Despite a shift to Pb-free solders in the majority of electronic assemblies, Pb-containing solders a...
The paper aimed to study the effect of aging and cooling rate on the reliability of the solder joint...
Recent legislation and growing environmental concerns have forced the electronics industry to discon...
Restrictions of lead in solder lead to adoption of SAC305 in consumer products. While high reliabili...
Restrictions of lead in solder lead to adoption of SAC305 in consumer products. While high reliabili...
As the traditional eutectic SnPb solder alloy has been outlawed, the electronic industry has almost ...
The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (...
Because of the environmental health implications of Pb, and legislation backing Restriction on Hazar...
With the very high rate of introducing new designs, the service lives of modern electronic devices h...
Solder alloys are vital in any electronic packaging industry especially in terms of its connectivity...
In these modern days, climatic change and environmental pollution is a pressing crisis. Many countri...
Driven by the trends towards miniaturization in lead free electronic products, researchers are putti...
Driven by the trends towards miniaturization in lead free electronic products, researchers are putti...
With the very high rate of introducing new designs, the service lives of modern electronic devices h...
*Corresponding author Abstract: In the next generation nanoelectronics and SiC based electronic pack...
Despite a shift to Pb-free solders in the majority of electronic assemblies, Pb-containing solders a...
The paper aimed to study the effect of aging and cooling rate on the reliability of the solder joint...
Recent legislation and growing environmental concerns have forced the electronics industry to discon...
Restrictions of lead in solder lead to adoption of SAC305 in consumer products. While high reliabili...
Restrictions of lead in solder lead to adoption of SAC305 in consumer products. While high reliabili...
As the traditional eutectic SnPb solder alloy has been outlawed, the electronic industry has almost ...
The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (...
Because of the environmental health implications of Pb, and legislation backing Restriction on Hazar...
With the very high rate of introducing new designs, the service lives of modern electronic devices h...
Solder alloys are vital in any electronic packaging industry especially in terms of its connectivity...
In these modern days, climatic change and environmental pollution is a pressing crisis. Many countri...
Driven by the trends towards miniaturization in lead free electronic products, researchers are putti...
Driven by the trends towards miniaturization in lead free electronic products, researchers are putti...
With the very high rate of introducing new designs, the service lives of modern electronic devices h...
*Corresponding author Abstract: In the next generation nanoelectronics and SiC based electronic pack...
Despite a shift to Pb-free solders in the majority of electronic assemblies, Pb-containing solders a...
The paper aimed to study the effect of aging and cooling rate on the reliability of the solder joint...