PPO composition as bonding base for electronic components, and method

A bonding base for electronic components, and a method. The bonding base comprises: a dielectric basic layer formed of a mixture comprising thermoplastic polymer, the polymer part of which mixture comprises 75 to 95 % by weight of thermoplastic PPO, the polymer part further comprising 5 to 20 % by weight of elastomer which is incompatible with PPO.Patent family as of 13.9.2021CN102482488 A 20120530 CN201080022083 20100514 CN102482488 B 20150311 CN201080022083 20100514 DE602009036432 D1 20160407 DE200960036432T 20090520 EP2253669 A1 20101124 EP20090160716 20090520 EP2253669 B1 20160224 EP20090160716 20090520 IN02385MN2011 A 20120330 IN2011MN02385 20111114 IN293879 B 20180309 IN2011MN02385 20111114 US2012088883 AA 20120412 US20100321432 20100514 US9464190 BB 20161011 US20100321432 20100514 WO10133759 A1 20101125 WO2010FI50391 20100514Link to current patent family on right