A layered apparatus comprises a substrate (100), a first electrically conductive layer (102) on and in contact with the substrate (100), a second patterned electrically conductive layer (104) which is in contact with the first electrically conductive layer (102), a third electrically conductive layer (112), a fourth electrically conductive layer (114) which is electrically insulated from the first electrically conductive layer (102), the second patterned electrically conductive layer (104) and the third electrically conductive layer (112), and an operationally active layer (108) between the first electrically conductive layer (102) and the fourth electrically conductive layer (114). The second patterned electrically conductive layer (104) i...
Process for joining layered elements (10) comprising a continuously conveyed current-conducting mate...
Disclosed is an electroplating method and products made therefrom, which in one embodiment includes ...
Disclosed is an electroplating method and products made therefrom, which in one embodiment includes ...
A layered apparatus comprises a substrate (100), a first electrically conductive layer (102) on and ...
Generally, the present invention can be viewed as providing a method for manufacturing a multilayer ...
A semiconductor apparatus having a silicon substrate layer at least portion of which is doped with d...
A semiconductor apparatus having a silicon substrate layer at least portion of which is doped with d...
The present invention relates to a device for an electrochemical cell, comprising a first layer of s...
[[abstract]]A dielectric layer in a dual-damascene interconnect is described. A dual-damascene inter...
The present invention relates to a device for an electrochemical cell, comprising a first layer of s...
[[abstract]]A dielectric pattern. On a substrate having a metal wiring layer formed thereon, a first...
A multilayered structure suitable as an electrode in a power source and a method of producing the sa...
A multilayered structure suitable as an electrode in a power source and a method of producing the sa...
NOVELTY - Via holes are produced extending down through all layers of the different substrates. The ...
[[abstract]]A method of patterning a dielectric layer. On a substrate having a metal wiring layer fo...
Process for joining layered elements (10) comprising a continuously conveyed current-conducting mate...
Disclosed is an electroplating method and products made therefrom, which in one embodiment includes ...
Disclosed is an electroplating method and products made therefrom, which in one embodiment includes ...
A layered apparatus comprises a substrate (100), a first electrically conductive layer (102) on and ...
Generally, the present invention can be viewed as providing a method for manufacturing a multilayer ...
A semiconductor apparatus having a silicon substrate layer at least portion of which is doped with d...
A semiconductor apparatus having a silicon substrate layer at least portion of which is doped with d...
The present invention relates to a device for an electrochemical cell, comprising a first layer of s...
[[abstract]]A dielectric layer in a dual-damascene interconnect is described. A dual-damascene inter...
The present invention relates to a device for an electrochemical cell, comprising a first layer of s...
[[abstract]]A dielectric pattern. On a substrate having a metal wiring layer formed thereon, a first...
A multilayered structure suitable as an electrode in a power source and a method of producing the sa...
A multilayered structure suitable as an electrode in a power source and a method of producing the sa...
NOVELTY - Via holes are produced extending down through all layers of the different substrates. The ...
[[abstract]]A method of patterning a dielectric layer. On a substrate having a metal wiring layer fo...
Process for joining layered elements (10) comprising a continuously conveyed current-conducting mate...
Disclosed is an electroplating method and products made therefrom, which in one embodiment includes ...
Disclosed is an electroplating method and products made therefrom, which in one embodiment includes ...