Advances in integrated circuit design and packaging techniques have introduced new ESD-susceptible (Electrostatic Discharge) circuit interfaces. This document will introduce these interfaces and the methods that were used to investigate their ESD robustness. Two test chips were designed to aid the analysis. The specialized design choices that allow for distinguishing between multiple failure locations are thoroughly illustrated. The testing plan is detailed and the test chip measurement results are analyzed. The results will compare different ESD protection techniques and illustrate the importance of having ESD protection at these interfaces. The results will also show how some interfaces are inherently more robust than others during a CDM ...
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Hardware and application-level manifestations of ESD soft failures were characterized for three sing...
Due to the nature of hardware and software, their respective design languages have evolved in isolat...
Every year, many poor health outcomes are the result of patients missing their medication, as prescr...
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Lam Research supplies equipment for manufacturing silicon wafers used in semiconductor manufacturing...
Focused ion beam (FIB) techniques were used to construct junction field effect transistors (JFETs) o...
Memory of a complex event includes a multitude of features (e.g., objects, people, and actions) as w...
The continuous downscaling of CMOS technology, the main engine of development of the semiconductor I...
Nickel-Zinc flow-assisted rechargeable batteries are currently being explored as a potential new gen...
The current paper proposes utilizing extant flow disruption data, collected from two cardiovascular ...
This thesis presents the development of a Modified Aggregate Feature Commonality Index (MAFCI) for a...
Hardware and application-level manifestations of ESD soft failures were characterized for three sing...
Due to the nature of hardware and software, their respective design languages have evolved in isolat...
Every year, many poor health outcomes are the result of patients missing their medication, as prescr...
Distress tolerance (DT) is considered to be a trait-like factor encompassing an individual’s behavio...
This study of SciTech Connect, the Department of Energy's Public Access Portal, was devised to ident...
Scanning ion conductance microscopy (SICM) is a powerful and non-invasive tool which allows substrat...
The aggressive scaling imposed by CMOS technology has put very stringent requirements on the dimensi...
Similarity, being a psychological notion, involves the comparison of finite object representations. ...
Lam Research supplies equipment for manufacturing silicon wafers used in semiconductor manufacturing...
Focused ion beam (FIB) techniques were used to construct junction field effect transistors (JFETs) o...
Memory of a complex event includes a multitude of features (e.g., objects, people, and actions) as w...
The continuous downscaling of CMOS technology, the main engine of development of the semiconductor I...
Nickel-Zinc flow-assisted rechargeable batteries are currently being explored as a potential new gen...
The current paper proposes utilizing extant flow disruption data, collected from two cardiovascular ...
This thesis presents the development of a Modified Aggregate Feature Commonality Index (MAFCI) for a...