Metal-organic chemical vapor deposition (MOCVD) from the tetrameric precursor copper(I) tert-butoxide, (Cu(O-t-Bu)) $\sb4$, results in the deposition of pure copper(I) oxide whiskers at 510 K and of copper metal with $\sim$2% oxygen contamination at 670 K. Quantitative analyses of the gaseous byproducts generated during the deposition, electron energy loss spectroscopy, and temperature programmed desorption experiments indicate that copper(I) oxide is formed by an elimination mechanism and copper metal is formed by deoxygenation of an initially deposited copper(I) oxide phase.New volatile monomeric Cu$\sp{\rm II}$ alkoxides have been synthesized with the general formula Cu(OR)$\sb2$L, where OR is OCH(CF$\sb3)\sb2$ or OC(CH$\sb3$)(CF$\sb3)\s...
The continued dominance of copper in microelectronic manufacturing is due in part to the techniques ...
Copper has become the material of choice for metallization of high-performance ultra-large scale in...
[[abstract]]This work demonstrated for the first time low temperature copper (Cu) film deposition by...
Metal-organic chemical vapor deposition (MOCVD) from the tetrameric precursor copper(I) tert-butoxid...
Copper metal thin films were grown via a CVD process on SiO2/Si substrates using different copper(II...
Copper metal films were grown on single-crystal strontium titanate (100) by the thermal decompositio...
Copper oxide thin films were prepared by organometallic chemical vapor deposition (OMCVD or MOCVD) t...
AbstractNew volatile heteroleptic copper(II) complexes having beta-ketoiminate (O,N) and diketonate ...
A nonfluorinated β-diketonate precursor, bis(t- butylacetoacetato)Cu(II) or Cu(tbaoac)2, was sy...
The nucleation and successful growth of copper (Cu) thin films on diffusion barrier/adhesion promote...
[[abstract]]Volatile low-melting Cull metal complexes Cu[OC(CF3)(2)CH2C(Me)=NMe](2) (4) and Cu[OC(CF...
A copper(II) hexafluoroacetylacetonate (1,1,1,5,5,5-hexafluoro-2,4-pentanedionate, hfa) adduct with ...
For the metalorganic chemical vapor deposition (MOCVD) of copper films using the β-diketonate comple...
[[abstract]]This work demonstrated for the first time low temperature copper (Cu) film deposition by...
Teplyakov, Andrew V.Metal deposition has a wide range of applications in many fields, from nano-fabr...
The continued dominance of copper in microelectronic manufacturing is due in part to the techniques ...
Copper has become the material of choice for metallization of high-performance ultra-large scale in...
[[abstract]]This work demonstrated for the first time low temperature copper (Cu) film deposition by...
Metal-organic chemical vapor deposition (MOCVD) from the tetrameric precursor copper(I) tert-butoxid...
Copper metal thin films were grown via a CVD process on SiO2/Si substrates using different copper(II...
Copper metal films were grown on single-crystal strontium titanate (100) by the thermal decompositio...
Copper oxide thin films were prepared by organometallic chemical vapor deposition (OMCVD or MOCVD) t...
AbstractNew volatile heteroleptic copper(II) complexes having beta-ketoiminate (O,N) and diketonate ...
A nonfluorinated β-diketonate precursor, bis(t- butylacetoacetato)Cu(II) or Cu(tbaoac)2, was sy...
The nucleation and successful growth of copper (Cu) thin films on diffusion barrier/adhesion promote...
[[abstract]]Volatile low-melting Cull metal complexes Cu[OC(CF3)(2)CH2C(Me)=NMe](2) (4) and Cu[OC(CF...
A copper(II) hexafluoroacetylacetonate (1,1,1,5,5,5-hexafluoro-2,4-pentanedionate, hfa) adduct with ...
For the metalorganic chemical vapor deposition (MOCVD) of copper films using the β-diketonate comple...
[[abstract]]This work demonstrated for the first time low temperature copper (Cu) film deposition by...
Teplyakov, Andrew V.Metal deposition has a wide range of applications in many fields, from nano-fabr...
The continued dominance of copper in microelectronic manufacturing is due in part to the techniques ...
Copper has become the material of choice for metallization of high-performance ultra-large scale in...
[[abstract]]This work demonstrated for the first time low temperature copper (Cu) film deposition by...