A mechanical testing setup was developed to study the fatigue response of fine thermo-sonic wire bond connection in low profile quad flat packages (LQFP). The testing set-up was designed to induce pre-defined multi-axial stresses in the wire bond loops of non-encapsulated packages in order to mimic their deformation behavior during the thermo-mechanical loading. Lifetime curves were obtained up to 1.0E7 loading cycles with fatigue failure occurring in the heat affected zone of the ball bond. The experimental fatigue data in combination with extended FEA provided the basis for a Coffin Manson lifetime model. The proposed fatigue testing procedure can be applied as a highly efficient method for evaluation of various wire bonded packages by us...
Based on the assumption that even properly manufactured bond interconnections are getting destroyed ...
Development of advanced electronic packages can be drastically affected by implementation of new mat...
Bonding wires made of aluminum are the most used materials for the transmission of electrical signal...
In this study the thermo-mechanical response of 25 μm Cu wire bonds in an LQFP-EPad (Low Profile Qua...
In this study the thermo-mechanical response of 25 μm Cu wire bonds in an LQFP-EPad package was inve...
In this study, the results of simulative and experimental investigations regarding thermal cycling (...
Every new development in device performance and packaging design, can drastically affect the reliabi...
In this study, a technology-oriented simplified mechanical fatigue testing approach for aluminium he...
Aluminum wire bonds, as used in a ceramic air cavity package for LDMOS, will intrinsically be prone ...
AbstractDue to the rapid development of packaging industry accelerated reliability testing for evalu...
Bond wire failure, primarily wire neck breakage, in power LED devices due to thermomechanical fatigu...
The reliability of power electronic devices is mainly limited due to thermo-mechanical fatigue of th...
This article presents various experimental studies on fatigue evaluation of wire bond interconnects...
In this study a high frequency mechanical fatigue testing procedure for evaluation of interfacial re...
Ultrasonically bonded Al wire bonds on Al metallization pads are widely used in power semiconductors...
Based on the assumption that even properly manufactured bond interconnections are getting destroyed ...
Development of advanced electronic packages can be drastically affected by implementation of new mat...
Bonding wires made of aluminum are the most used materials for the transmission of electrical signal...
In this study the thermo-mechanical response of 25 μm Cu wire bonds in an LQFP-EPad (Low Profile Qua...
In this study the thermo-mechanical response of 25 μm Cu wire bonds in an LQFP-EPad package was inve...
In this study, the results of simulative and experimental investigations regarding thermal cycling (...
Every new development in device performance and packaging design, can drastically affect the reliabi...
In this study, a technology-oriented simplified mechanical fatigue testing approach for aluminium he...
Aluminum wire bonds, as used in a ceramic air cavity package for LDMOS, will intrinsically be prone ...
AbstractDue to the rapid development of packaging industry accelerated reliability testing for evalu...
Bond wire failure, primarily wire neck breakage, in power LED devices due to thermomechanical fatigu...
The reliability of power electronic devices is mainly limited due to thermo-mechanical fatigue of th...
This article presents various experimental studies on fatigue evaluation of wire bond interconnects...
In this study a high frequency mechanical fatigue testing procedure for evaluation of interfacial re...
Ultrasonically bonded Al wire bonds on Al metallization pads are widely used in power semiconductors...
Based on the assumption that even properly manufactured bond interconnections are getting destroyed ...
Development of advanced electronic packages can be drastically affected by implementation of new mat...
Bonding wires made of aluminum are the most used materials for the transmission of electrical signal...