Within these studies the piezoresistive effect was analyzed for 6H-SiC and 4H-SiC material doped with various elements: N, B, and Sc. Bulk SiC crystals with a specific concentration of dopants were fabricated by the Physical Vapor Transport (PVT) technique. For such materials, the structures and properties were analyzed using X-ray diffraction, SEM, and Hall measurements. The samples in the form of a beam were also prepared and strained (bent) to measure the resistance change (Gauge Factor). Based on the results obtained for bulk materials, piezoresistive thin films on 6H-SiC and 4H-SiC substrate were fabricated by Chemical Vapor Deposition (CVD). Such materials were shaped by Focus Ion Beam (FIB) into pressure sensors with a specific geome...
Wide band gap materials such as silicon carbide and diamond are considered more suitable compared to...
Cubic silicon carbide is a promising material for Micro Electro Mechanical Systems (MEMS) applicatio...
The deposition of diamond films on silicon substrate by MWPECVD is described and microstructural cha...
<div>The purpose of this chapter is to present an overview of the deposition techniques of SiC films...
AbstractIn this work, we report the fabrication and characterization of a SiC/SiO2/Si piezoresistive...
The slow etching rate of conventional micro-machining processes is hindering the use of bulk silicon...
A 4H-SiC pressure sensor with piezoresistive transducers, for harsh environment applications, e.g., ...
This letter presents for the first time the piezoresistive effect in p-type 4H-SiC. Longitudinal and...
Analytical results of 6H-SiC Piezoresistive Pressure Sensor, with an epilayer having an impurity con...
Piezoresistive mechanical sensors play a very important role in modern industries. MEMS pressure sen...
4H-silicon carbide based sensors are promising candidates for replacing prevalent silicon-based coun...
In different industrial applications, such as injection molding and/or hot rolling, it is necessary ...
A prototype monolithic 6H-SiC pressure sensor operational up to 350°C, with potential to operate up ...
This work focusses on the design and fabrication of surface micromachined pressure sensors, designed...
The slow etching rate of conventional micro-machining processes is hindering the use of bulk silicon...
Wide band gap materials such as silicon carbide and diamond are considered more suitable compared to...
Cubic silicon carbide is a promising material for Micro Electro Mechanical Systems (MEMS) applicatio...
The deposition of diamond films on silicon substrate by MWPECVD is described and microstructural cha...
<div>The purpose of this chapter is to present an overview of the deposition techniques of SiC films...
AbstractIn this work, we report the fabrication and characterization of a SiC/SiO2/Si piezoresistive...
The slow etching rate of conventional micro-machining processes is hindering the use of bulk silicon...
A 4H-SiC pressure sensor with piezoresistive transducers, for harsh environment applications, e.g., ...
This letter presents for the first time the piezoresistive effect in p-type 4H-SiC. Longitudinal and...
Analytical results of 6H-SiC Piezoresistive Pressure Sensor, with an epilayer having an impurity con...
Piezoresistive mechanical sensors play a very important role in modern industries. MEMS pressure sen...
4H-silicon carbide based sensors are promising candidates for replacing prevalent silicon-based coun...
In different industrial applications, such as injection molding and/or hot rolling, it is necessary ...
A prototype monolithic 6H-SiC pressure sensor operational up to 350°C, with potential to operate up ...
This work focusses on the design and fabrication of surface micromachined pressure sensors, designed...
The slow etching rate of conventional micro-machining processes is hindering the use of bulk silicon...
Wide band gap materials such as silicon carbide and diamond are considered more suitable compared to...
Cubic silicon carbide is a promising material for Micro Electro Mechanical Systems (MEMS) applicatio...
The deposition of diamond films on silicon substrate by MWPECVD is described and microstructural cha...