Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes
- Mladenović, Ivana
- Bošković, Marko
- Lamovec, Jelena
- Vuksanović, Marija M.
- Nikolić, Nebojša D.
- Radojević, Vesna
- Vasiljević-Radović, Dana
Publication date
January 2021
DOI Publisher
Institute of Electrical and Electronics Engineers (IEEE) Journal
issn:2159-1660Abstract
Electrochemically deposited copper coatings obtained from sulfate baths on brass substrates in the regime of direct current (DC) with and without an application of ultrasound mixing of electrolytes (DC/US) have been studied. The aim of the research was analysis of the influence of current density, ultrasonic mixing of electrolyte and presence of additives on the electrodeposited coatings, in order to obtain uniform compact coatings suitable for potential application in MEMS devices. Structural, electrical and mechanical behavior of thin copper coatings were investigated using SEM, AFM, four- point probe method and Vickers hardness test.Niš, Serbia, 12-14 Sept. 202
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