Add to ORKGA new induction based sintering process for chip level bonding of power electronics components is presented in which silver particles containing pastes are used as bonding material. Using finite element methods, the bonding process was analyzed and optimized so that efficient sintering of the particles could be achieved in subsequent heating and bonding tests. Therefore, the process has great potential for application in the industrial production of electronic components
Ag sintering is a promising joining technology for high temperature power electronic packaging, part...
Additive manufacturing for electronics is one of the world's fastest growing technologies in recent ...
With the increasing application of wide bandgap materials such as silicon carbide and gallium nitrid...
A new induction based sintering process for chip level bonding of power electronics component...
Power electronic systems are needed in diverse areas such as electricity transmission or electrical ...
Ag and Cu powders were mechanically alloyed using high-energy planetary milling to evaluate the sint...
For decades soldering has been the technology of choice in die bonding. However, due to worldwide he...
Ag nanoparticle paste is prepared based on the polyol method and subsequent concentration by centrif...
Silver sintering is becoming an attractive alternative to soldering, especially for high temperature...
International audienceProcessing parameters of Spark Plasma Sintering (SPS) technique were constrain...
Die-attach bonding is a key process to realize high-temperature operation of power semiconductor dev...
Sintering of nanosilver paste has been extensively studied as a lead-free die-attach solution for bo...
Organic printed circuit boards (PCB) together with standard joining technologies like soldering or a...
In the realm of power modules a strong trend toward high temperature and high reliability ap-plicati...
High temperature power electronics based on wide-bandgap semiconductors have prominent applications,...
Ag sintering is a promising joining technology for high temperature power electronic packaging, part...
Additive manufacturing for electronics is one of the world's fastest growing technologies in recent ...
With the increasing application of wide bandgap materials such as silicon carbide and gallium nitrid...
A new induction based sintering process for chip level bonding of power electronics component...
Power electronic systems are needed in diverse areas such as electricity transmission or electrical ...
Ag and Cu powders were mechanically alloyed using high-energy planetary milling to evaluate the sint...
For decades soldering has been the technology of choice in die bonding. However, due to worldwide he...
Ag nanoparticle paste is prepared based on the polyol method and subsequent concentration by centrif...
Silver sintering is becoming an attractive alternative to soldering, especially for high temperature...
International audienceProcessing parameters of Spark Plasma Sintering (SPS) technique were constrain...
Die-attach bonding is a key process to realize high-temperature operation of power semiconductor dev...
Sintering of nanosilver paste has been extensively studied as a lead-free die-attach solution for bo...
Organic printed circuit boards (PCB) together with standard joining technologies like soldering or a...
In the realm of power modules a strong trend toward high temperature and high reliability ap-plicati...
High temperature power electronics based on wide-bandgap semiconductors have prominent applications,...
Ag sintering is a promising joining technology for high temperature power electronic packaging, part...
Additive manufacturing for electronics is one of the world's fastest growing technologies in recent ...
With the increasing application of wide bandgap materials such as silicon carbide and gallium nitrid...