Silver nanoparticles (Ag NPs) of ~ 6 nm in size were synthesized by the reduction of silver 2-[2-(2-methoxyethoxy)ethoxy]acetate by benzyl alcohol acting both as the solvent and as the reducer. The as-synthesized Ag NPs were dispersed in a mixture of nontoxic solvents with different boiling temperatures (butanol and propylene glycol ethers) to prepare ink. The ink was spin-coated on polyimide films and processed with thermal and laser sintering. After thermal sintering, the silver films have a non-uniform structure and contain many voids, causing their resistivity to be quite high (28 µΩ×cm). Laser sintering of the Ag NPs inks spin-coated on a polyimide film using a fiber laser operating at a wavelength of 1.064 µm in a pulse-periodic mode ...
In this work, the In-Situ properties of silver nanoparticle ink were estimated during laser sinterin...
The conversion of silver nanoparticle (NP) paste films into highly conductive films at low sintering...
Low ink sintering temperature is desired for flexible electronics, as it would widen the application...
Silver nanoparticles (Ag NPs) of ~ 6 nm in size were synthesized by the reduction of silver 2-[2-(2-...
Herein, we investigated the effect of silver particle size and the type of organic stabilizers on th...
The fabrication of low-cost and mechanically robust flexible electronic patterns has increasingly ga...
Electrical conductivity is a key factor in measuring performance of printed electronics, but the con...
In this study, the sintering behavior of silver (Ag) nanoparticle inks was investigated when differe...
Development of cost-effective and environmentally friendly manufacturing methods will enable importa...
Abstract: We investigated the sintering and consolidation phenomena of silver nanoparticles under va...
With the ever-increasing demand for lightweight, small, flexible, and portable devices, solving prob...
In this study, the laser sintering of inkjet-printed silver lines was evaluated. Silver-nanoparticle...
As an alternative technology to replace lithographic process, direct printing of conductive nanoflui...
Near infrared(NIR) sintering technology is a photonic sintering approach for metal nanoparticle inks...
The presented thesis addresses the composition, inkjet-printing and low-temperature sintering of the...
In this work, the In-Situ properties of silver nanoparticle ink were estimated during laser sinterin...
The conversion of silver nanoparticle (NP) paste films into highly conductive films at low sintering...
Low ink sintering temperature is desired for flexible electronics, as it would widen the application...
Silver nanoparticles (Ag NPs) of ~ 6 nm in size were synthesized by the reduction of silver 2-[2-(2-...
Herein, we investigated the effect of silver particle size and the type of organic stabilizers on th...
The fabrication of low-cost and mechanically robust flexible electronic patterns has increasingly ga...
Electrical conductivity is a key factor in measuring performance of printed electronics, but the con...
In this study, the sintering behavior of silver (Ag) nanoparticle inks was investigated when differe...
Development of cost-effective and environmentally friendly manufacturing methods will enable importa...
Abstract: We investigated the sintering and consolidation phenomena of silver nanoparticles under va...
With the ever-increasing demand for lightweight, small, flexible, and portable devices, solving prob...
In this study, the laser sintering of inkjet-printed silver lines was evaluated. Silver-nanoparticle...
As an alternative technology to replace lithographic process, direct printing of conductive nanoflui...
Near infrared(NIR) sintering technology is a photonic sintering approach for metal nanoparticle inks...
The presented thesis addresses the composition, inkjet-printing and low-temperature sintering of the...
In this work, the In-Situ properties of silver nanoparticle ink were estimated during laser sinterin...
The conversion of silver nanoparticle (NP) paste films into highly conductive films at low sintering...
Low ink sintering temperature is desired for flexible electronics, as it would widen the application...