It is a well known fact that vibration is one of the most important loading condition in electronic systems. This study deals with dynamic analysis of a printed circuit board (PCB) with a component on it under vibratory loading. The objective of the study is to develop an analytical model for common PCB configurations and electronic components on them in order to predict dynamics of the assembly under vibratory loading, and thus to study the effects of component location. As an application, in this paper an analytical model of a simply supported PCB with a component is presented. The validity of the two degree of freedom analytical model is demonstrated by comparing numerical results for random vibration input with those of a finite element...
Vibration analysis of Fine-pitch Ball Grid Array (FBGA) packages mounted on a Printed Circuit Board ...
Vibration-induced loads stress electronical equipment particularly in automotive applications. If th...
The operating capacity and service life of printed circuit boards in various electronic equipment an...
In this thesis, vibration analyses of electronic assemblies that consist of an electronic box, print...
The reliability of the printed circuit board assembly under dynamic environments, such as those foun...
The paper presents an approach to bring numerical simulation and electronic design engineering close...
This paper develops a novel full analytic model for vibration analysis of solid-state electronic com...
The paper represents theoretical and experimental vibration analysis of electronic packages. The res...
AbstractSince the level of vibration always depends on the natural frequencies of the system, it is ...
The demand for structurally reliable Printed Circuit Boards (PCB) has increased as more functions ar...
International audienceThe plastic ball grid array (PBGA) package has become a major packaging type i...
This paper summarizes the main features of a Monte Carlo approach to calculate safety factors to be ...
Abstract Aerospace vehicles are mostly exposed to random vibration loads during its operational life...
Abstract. The impulse between the launch vehicle and the atmosphere can generate a lot of noise and ...
[[abstract]]In this paper, the electronic shearography and modal analysis technique were used to inv...
Vibration analysis of Fine-pitch Ball Grid Array (FBGA) packages mounted on a Printed Circuit Board ...
Vibration-induced loads stress electronical equipment particularly in automotive applications. If th...
The operating capacity and service life of printed circuit boards in various electronic equipment an...
In this thesis, vibration analyses of electronic assemblies that consist of an electronic box, print...
The reliability of the printed circuit board assembly under dynamic environments, such as those foun...
The paper presents an approach to bring numerical simulation and electronic design engineering close...
This paper develops a novel full analytic model for vibration analysis of solid-state electronic com...
The paper represents theoretical and experimental vibration analysis of electronic packages. The res...
AbstractSince the level of vibration always depends on the natural frequencies of the system, it is ...
The demand for structurally reliable Printed Circuit Boards (PCB) has increased as more functions ar...
International audienceThe plastic ball grid array (PBGA) package has become a major packaging type i...
This paper summarizes the main features of a Monte Carlo approach to calculate safety factors to be ...
Abstract Aerospace vehicles are mostly exposed to random vibration loads during its operational life...
Abstract. The impulse between the launch vehicle and the atmosphere can generate a lot of noise and ...
[[abstract]]In this paper, the electronic shearography and modal analysis technique were used to inv...
Vibration analysis of Fine-pitch Ball Grid Array (FBGA) packages mounted on a Printed Circuit Board ...
Vibration-induced loads stress electronical equipment particularly in automotive applications. If th...
The operating capacity and service life of printed circuit boards in various electronic equipment an...