This paper presents a study for the effects of different types of solvents on dissolution of photo resist inside the parylene micro channels. Theoretical and experimental studies were carried out to model the dynamic behavior of the dissolution. In this account, dissolution rate expressions were derived by taking into account the reaction of resist with the solvent. Micro channels with a cross section of 15 mu m x 50 mu m were fabricated by encapsulating photo resist inside the parylene layers and using glass wafer as substrate. Experimental results indicated that photo resist dissolution in dipolar aprotic solvents was much faster than the other types of solvents. This finding can be used to select alternative chemicals for stripping encap...
The development of a polymeric resist by dissolution may be described as a two-step process (1). Fir...
This paper proposed a simple and effective fabrication method of Parylene C-caulked PDMS (pcPDMS) fo...
EUV lithography is proposed as the next technology to be used in microelectronics production for 10n...
We report here a detailed study of sacrificial layer dissolution of photoresist by acetone in microc...
Parylene C has been preferred in various microfluidic and packaging applications as a chemical barri...
This work focuses on understanding the dissolution phenomenon of surface inhibition, which is observ...
This study reports the penetration properties of various Parylenes (i.e., C, N and HT) inside long m...
The swelling and dissolution of thin film poly(methyl methacrylate), PMMA, in methyl isobutyl ketone...
ABSTRACT A new, enhanced kinetic model for the dissolution rate of photoresists is proposed which bu...
Polymer dissolution in a solvent involves solvent diffusion and polymer dissolution. A solvent diffu...
The resist development step in photolithography is a complex process involving selective dissolution...
ABSTRACT: The function of common, positive tone photoresist materials is based on radiation-induced ...
textFabrication of microelectronic devices relies upon the photolithographic process for patterning...
Polymer dissolution in solvents is an important area of interest in polymer science and engineering ...
The development step in photolithography is a complex process involving selective dissolution betwee...
The development of a polymeric resist by dissolution may be described as a two-step process (1). Fir...
This paper proposed a simple and effective fabrication method of Parylene C-caulked PDMS (pcPDMS) fo...
EUV lithography is proposed as the next technology to be used in microelectronics production for 10n...
We report here a detailed study of sacrificial layer dissolution of photoresist by acetone in microc...
Parylene C has been preferred in various microfluidic and packaging applications as a chemical barri...
This work focuses on understanding the dissolution phenomenon of surface inhibition, which is observ...
This study reports the penetration properties of various Parylenes (i.e., C, N and HT) inside long m...
The swelling and dissolution of thin film poly(methyl methacrylate), PMMA, in methyl isobutyl ketone...
ABSTRACT A new, enhanced kinetic model for the dissolution rate of photoresists is proposed which bu...
Polymer dissolution in a solvent involves solvent diffusion and polymer dissolution. A solvent diffu...
The resist development step in photolithography is a complex process involving selective dissolution...
ABSTRACT: The function of common, positive tone photoresist materials is based on radiation-induced ...
textFabrication of microelectronic devices relies upon the photolithographic process for patterning...
Polymer dissolution in solvents is an important area of interest in polymer science and engineering ...
The development step in photolithography is a complex process involving selective dissolution betwee...
The development of a polymeric resist by dissolution may be described as a two-step process (1). Fir...
This paper proposed a simple and effective fabrication method of Parylene C-caulked PDMS (pcPDMS) fo...
EUV lithography is proposed as the next technology to be used in microelectronics production for 10n...