An Optimization Study on Electrodeposition of Copper from Acid Bath with Supercritical Carbon Dioxide Fluid

An optimization study on electrodeposition of copper film from sulfuric acid bath in presence of supercritical carbon dioxide fluid was explored for electronic application. Factors that influence roughness of copper deposit were also discussed. A material property of copper deposition has been considered as a response variable and statistical experimental methods have been used to optimize the process parameters and the response. Effects of various current density, pressure and temperature were investigated to select the optimal operation factors. Scanning electron microscopy and?atomic force microscopy?were applied to determine average particle sizes and to confirm the characteristic of the metallic film obtained.?Box-Behnken?design and RSM?(response surface methodology)?were applied to find the optimal conditions of supercritical electroplating process. Regression model was built by fitting the experimental results with a second-order polynomial and was proved to be statistically significant since the coefficient of determination coefficient (R2) was 0.9844.?The optimal film of deposited can be obtained at current density 0.17?A/dm2, pressure 186 bar and temperature 31.5 ?C