Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process

This study investigates the power cycling reliability of nanosilver sintered joints formed by a time-reduced sintering process, designed for use on a die bonder. A range of sintering parameters, reflecting different levels of manufacturability, were used to produce sintered joints in respect of shear strength and porosity, within a process cycle time of a few seconds. The reliability of the sintered attachments were evaluated against Pb5Sn solder joints under constant temperature swing power cycling conditions over the range 50 to 200 °C. The thermal performance and microstructural changes of the sintered joints were monitored and evaluated non-destructively at regular intervals using transient thermal impedance and X-ray computed tomography. The results show that sintered joints with higher shear strengths (>50 MPa) and lower porosities (