We present an imaging system that enables the extraction of three different types of information: First, the topography measurement of an electronic device at rest; then, two other informations are obtained when the same device is submitted to a transient current: on one hand, the induced surface displacement and on the other hand, the qualitative surface temperature variations field. The same bench includes two imaging techniques, one based upon interferometry, the other upon thermoreflectance, both of them using a light-emitting diode as a source of light. Results on a microheater are presented
We have studied temperature variations on two dissipative structures with two different techniques. ...
We have studied the electrically induced off-plane surface displacement on two microelectronic devic...
This paper presents micro-interferometry as a measurement technique to extract temperature profiles ...
We present an imaging system that enables the extraction of three different types of information: Fi...
We present an imaging technique to measure static surface displacements of electronic components. A ...
We present in this letter a cost effective noncontact imaging technique well adapted to measure the ...
We present a scanning imaging system using galvanometric mirrors dedicated to the thermomechanical i...
We present a thermoreflectance imaging system using a focused laser sweeping the device under test w...
This paper summarizes recent results obtained at TU Vienna in the field of thermal and free-carrier ...
Abstract—This paper presents a new approach for measuring physical variables on micro-electronic com...
We have developed a CCD-based thermoreflectance microscope which can deliver thermal images of worki...
National audienceWe have studied temperature variations on two submicrometric dissipative structures...
International audienceThis paper presents a new approach for measuring physical variables on micro- ...
We have studied the electrically induced off-plane surface displacement on two microelectronic devic...
We have studied temperature variations on two dissipative structures with two different techniques. ...
We have studied the electrically induced off-plane surface displacement on two microelectronic devic...
This paper presents micro-interferometry as a measurement technique to extract temperature profiles ...
We present an imaging system that enables the extraction of three different types of information: Fi...
We present an imaging technique to measure static surface displacements of electronic components. A ...
We present in this letter a cost effective noncontact imaging technique well adapted to measure the ...
We present a scanning imaging system using galvanometric mirrors dedicated to the thermomechanical i...
We present a thermoreflectance imaging system using a focused laser sweeping the device under test w...
This paper summarizes recent results obtained at TU Vienna in the field of thermal and free-carrier ...
Abstract—This paper presents a new approach for measuring physical variables on micro-electronic com...
We have developed a CCD-based thermoreflectance microscope which can deliver thermal images of worki...
National audienceWe have studied temperature variations on two submicrometric dissipative structures...
International audienceThis paper presents a new approach for measuring physical variables on micro- ...
We have studied the electrically induced off-plane surface displacement on two microelectronic devic...
We have studied temperature variations on two dissipative structures with two different techniques. ...
We have studied the electrically induced off-plane surface displacement on two microelectronic devic...
This paper presents micro-interferometry as a measurement technique to extract temperature profiles ...