Add to ORKGWe have studied the electrically induced off-plane surface displacement on two microelectronic devices using Scanning Joule Expansion Microscopy (SJEM). We present the experimental method and surface displacement results. We show that they can be successfully compared with surface displacement images obtained using an optical interferometry method. We also present thermal images using Scanning Thermal Microscopy (SThM) technique to underline that SJEM is more adapted to higher frequency measurements, which should improve the spatial resolution
We present a scanning imaging system using galvanometric mirrors coupled to a heterodyne interferome...
The miniaturisation of integrated circuits causes higher power-densities. The interconnection joinin...
We present an original imaging method to measure the three components of the surface displacement of...
We have studied the electrically induced off-plane surface displacement on two microelectronic devic...
Abstract- We have studied the electrically induced off-plane surface displacement on two microelectr...
We have studied the electrically induced off-plane surface displacement on two microelectronic devic...
High temperatures and excessive heat generation cause degradation and malfunction of microelectronic...
We present an imaging technique to measure static surface displacements of electronic components. A ...
International audienceControl of filament growth within conductive bridge random access memories (CB...
We present an original optical approach for the thermomechanical study of electronic devices. We hav...
We present an imaging system that enables the extraction of three different types of information: Fi...
We present an original optical approach for the thermomechanical study of electronic devices. We hav...
An analytical model, validated by experiments and finite element simulations, is developed to study ...
This thesis presents the development of a quantitative nanometer-scale thermal metrology technique, ...
We present a scanning imaging system using galvanometric mirrors coupled to a heterodyne interferome...
The miniaturisation of integrated circuits causes higher power-densities. The interconnection joinin...
We present an original imaging method to measure the three components of the surface displacement of...
We have studied the electrically induced off-plane surface displacement on two microelectronic devic...
Abstract- We have studied the electrically induced off-plane surface displacement on two microelectr...
We have studied the electrically induced off-plane surface displacement on two microelectronic devic...
High temperatures and excessive heat generation cause degradation and malfunction of microelectronic...
We present an imaging technique to measure static surface displacements of electronic components. A ...
International audienceControl of filament growth within conductive bridge random access memories (CB...
We present an original optical approach for the thermomechanical study of electronic devices. We hav...
We present an imaging system that enables the extraction of three different types of information: Fi...
We present an original optical approach for the thermomechanical study of electronic devices. We hav...
An analytical model, validated by experiments and finite element simulations, is developed to study ...
This thesis presents the development of a quantitative nanometer-scale thermal metrology technique, ...
We present a scanning imaging system using galvanometric mirrors coupled to a heterodyne interferome...
The miniaturisation of integrated circuits causes higher power-densities. The interconnection joinin...
We present an original imaging method to measure the three components of the surface displacement of...